Inventor · disambiguated record
Yi Feng
Also filed as: FENG YI · FENG YI-HENG
21 granted patents·9 pending applications·383 citations·filing 1996–2023
93Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO22FENG YI2HEWLETT PACKARD DEVELOPMENT CO LP1INST INFORMATION INDUSTRY1LI SHAO-WEI1
Top patents by PatentIndex Score
30 records- 0193US11427720B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Aug 30, 2022·4 cites·4 claims
- 0291US6107117AMethod of making an organic thin film transistorLUCENT TECHNOLOGIES INC·Filed 1996·Granted Aug 22, 2000·304 cites·16 claims
- 0389US6722756B2Capping shroud for fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Apr 20, 2004·47 cites·29 claims
- 0487US10913205B2Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Feb 9, 2021·5 cites·13 claims
- 0587US9777179B2Ink set including a pre-treatment fixing fluid and a fixable, UV curable inkHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Oct 3, 2017·4 cites·14 claims
- 0686US12049041B23-D printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Jul 30, 2024·0 cites·10 claims
- 0786US10717232B2Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jul 21, 2020·3 cites·20 claims
- 0886US10710301B2Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jul 14, 2020·4 cites·15 claims
- 0984US11787938B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Oct 17, 2023·0 cites·18 claims
- 1084US11739214B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Aug 29, 2023·0 cites·15 claims
- 1182US11413816B2Compositions for printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 16, 2022·2 cites·14 claims
- 1280US11718024B23-D printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Aug 8, 2023·0 cites·11 claims
- 1377US11679553B2Compositions for printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Jun 20, 2023·0 cites·15 claims
- 1464US11235521B23-D printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Feb 1, 2022·0 cites·13 claims
- 1562US6902260B2Fluid ejection device adherenceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jun 7, 2005·10 cites·52 claims
- 1661US10167404B2Fixable, UV curable inkHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jan 1, 2019·0 cites·10 claims
- 1761US2018104894A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 1860US11396130B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jul 26, 2022·0 cites·18 claims
- 1951US10576685B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Mar 3, 2020·0 cites·15 claims
- 2051US2024088824A1A composite material frame profile, solar energy module frame and its manufacturing method thereofZHEJIANG DEYILONG TECH CO LTD·Filed 2022·Application pending·0 cites
- 2150US11937563B2GreenhouseFENG YI·Filed 2020·Granted Mar 26, 2024·0 cites·8 claims
- 2248US2021138724A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 2347US2021187839A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 2447US2020398484A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 2544US9423716B2Charge rollerLI SHAO-WEI·Filed 2012·Granted Aug 23, 2016·0 cites·18 claims
- 2644US2004035071A1Molded grating provided with reinforcement and attaching arrangementFiled 2002·Application pending·0 cites
- 2741US2019054688A1Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Application pending·0 cites
- 2838US10534282B2Charge rollerFENG YI·Filed 2012·Granted Jan 14, 2020·0 cites·13 claims
- 2935US2021402697A1Computations of values for build material recyclability ratio selectionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 3028US2011122025A1Antenna adjustment apparatus, antenna adjustment method and tangible machine-readable medium thereofINST INFORMATION INDUSTRY·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →