Inventor · disambiguated record
Yi-Min Fu
Also filed as: FU YI · Fu yi-min
14 granted patents·14 pending applications·27 citations·filing 2011–2025
87Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD23CHEN ZHEN2TOSHIBA KK2GUANGDONG SILVER AGE SCI & TECH CO LTD1
Top patents by PatentIndex Score
28 records- 0193US8669585B1LED that has bounding silicon-doped regions on either side of a strain release layerCHEN ZHEN·Filed 2012·Granted Mar 11, 2014·20 cites·28 claims
- 0282US9570657B2LED that has bounding silicon-doped regions on either side of a strain release layerTOSHIBA KK·Filed 2014·Granted Feb 14, 2017·4 cites·37 claims
- 0378US12412820B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·12 claims
- 0478US12412819B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·9 claims
- 0574US2025038113A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0673US2025087601A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0771US2025279375A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0870US12176291B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·18 claims
- 0969US12438094B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·16 claims
- 1069US12334452B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1167US12199047B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·6 claims
- 1267US12051641B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·9 claims
- 1367US9012939B2N-type gallium-nitride layer having multiple conductive intervening layersCHEN ZHEN·Filed 2011·Granted Apr 21, 2015·3 cites·15 claims
- 1460US2025183239A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1559US8994064B2Led that has bounding silicon-doped regions on either side of a strain release layerTOSHIBA KK·Filed 2014·Granted Mar 31, 2015·0 cites·38 claims
- 1659US2025336739A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1758US2025311452A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1858US2025140765A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1956US2025140770A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2055US2025079254A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2155US2024371721A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2254US2024421026A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2353US2024363545A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2452US2024264389A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2551US10396021B2Fabrication method of layer structure for mounting semiconductor deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 27, 2019·0 cites·8 claims
- 2651US9972564B2Layer structure for mounting semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 15, 2018·0 cites·7 claims
- 2750US2023378072A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 2838US10106651B2PEEK/NANO-HA composites for SLS and preparation methods thereofGUANGDONG SILVER AGE SCI & TECH CO LTD·Filed 2018·Granted Oct 23, 2018·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Yi-Min Fu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →