Inventor · disambiguated record
Yi Koan Hong
Also filed as: HONG YI KOAN
13 granted patents·2 pending applications·95 citations·filing 2010–2023
89Inventor score
Top patents by PatentIndex Score
15 records- 0196US9865581B2Method of fabricating multi-substrate semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 9, 2018·25 cites·20 claims
- 0296US8575753B2Semiconductor device having a conductive structure including oxide and non oxide portionsCHOI SUK-HUN·Filed 2010·Granted Nov 5, 2013·43 cites·32 claims
- 0393US9530706B2Semiconductor devices having hybrid stacking structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·13 cites·17 claims
- 0492US11295981B2Semiconductor devices including through vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·3 cites·20 claims
- 0586US9653623B2Methods of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 16, 2017·6 cites·20 claims
- 0676US12107109B2Semiconductor device including through via, semiconductor package, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0775US9502274B2Wafer loaders having buffer zonesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 22, 2016·3 cites·6 claims
- 0871US10734430B2Semiconductor device including through via, semiconductor package, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·1 cites·11 claims
- 0970US10446774B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·1 cites·19 claims
- 1067US11626443B2Semiconductor device including through via, semiconductor package, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·8 claims
- 1166US11791211B2Semiconductor devices including through vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 1256US10978655B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 1350US9431341B2Semiconductor device having metal patterns and piezoelectric patternsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·20 claims
- 1446US2017110445A1Semiconductor devices having hybrid stacking structures and methods of fabricating the sameKANG PIL-KYU·Filed 2016·Application pending·0 cites
- 1530US2012214316A1Semiconductor devices having planarized insulation layers and methods of fabricating the sameBAE JIN-WOO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →