Inventor · disambiguated record
Yi-Hwa Hsieh
Also filed as: HSIEH YI HWA
8 granted patents·1 pending application·152 citations·filing 2001–2019
86Inventor score
Top patents by PatentIndex Score
9 records- 0192US6366486B1Power supply device for enhancing heat-dissipating effectDELTA ELECTRONICS INC·Filed 2001·Granted Apr 2, 2002·90 cites·18 claims
- 0291US8467188B2Modular heat-dissipating deviceHSIEH YI-HWA·Filed 2011·Granted Jun 18, 2013·33 cites·11 claims
- 0382US7365972B2Electronic device with dual heat dissipating structuresDELTA ELECTRONICS INC·Filed 2006·Granted Apr 29, 2008·17 cites·18 claims
- 0480US10568206B2Printed circuit board assembly and assembling method thereofDELTA ELECTRONICS INC·Filed 2019·Granted Feb 18, 2020·2 cites·11 claims
- 0580US10568207B2Printed circuit board assembly and assembling method thereofDELTA ELECTRONICS INC·Filed 2019·Granted Feb 18, 2020·2 cites·13 claims
- 0679US10321565B2Printed circuit board assembly and assembling method thereofDELTA ELECTRONICS INC·Filed 2017·Granted Jun 11, 2019·2 cites·18 claims
- 0779US8462509B2Heat-dissipating module and electronic device using sameHSIEH YI-HWA·Filed 2011·Granted Jun 11, 2013·6 cites·19 claims
- 0843US2009097211A1Circuit module and circuit board assembly having sip connectorDELTA ELECTRONICS INC·Filed 2008·Application pending·0 cites
- 0938US7491583B2Power module fabrication method and structure thereofDELTA ELECTRONICS INC·Filed 2006·Granted Feb 17, 2009·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →