Inventor · disambiguated record
Ying-Chih Hsu
Also filed as: HSU YING-CHIH
24 granted patents·3 pending applications·85 citations·filing 2010–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19TAIWAN SEMICONDUCTOR MFG3HSU YING-CHIH1HUANG JUI-CHENG1ROTH ALAN1
Top patents by PatentIndex Score
27 records- 0196US11855539B2Power moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0296US11671010B2Power delivery for multi-chip-package using in-package voltage regulatorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·4 cites·20 claims
- 0396US8598854B2LDO regulators for integrated applicationsSOENEN ERIC·Filed 2010·Granted Dec 3, 2013·39 cites·21 claims
- 0490US10151644B2Combination current generator configured to selectively generate one of a PTAT and a CTAT currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 11, 2018·5 cites·27 claims
- 0588US11245329B2Power moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 8, 2022·4 cites·16 claims
- 0687US12500157B2Semiconductor package device with integrated inductor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
- 0786US8324955B2Level shifter designROTH ALAN·Filed 2011·Granted Dec 4, 2012·8 cites·21 claims
- 0885US2025096684A1Power moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0984US12155307B2Power moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 1084US11158448B2Packaging layer inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 26, 2021·4 cites·19 claims
- 1182US2025362337A1Semiconductor packages with through via structures and methods for testing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1281US8547259B1Buffer offset modulationHUANG JUI-CHENG·Filed 2012·Granted Oct 1, 2013·6 cites·20 claims
- 1379US12002770B2Power management semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 4, 2024·1 cites·20 claims
- 1478US12046544B2Semiconductor package device with integrated inductor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 1575US8232903B2Finger-split and finger-shifted technique for high-precision current mirrorHSU YING-CHIH·Filed 2010·Granted Jul 31, 2012·6 cites·20 claims
- 1673US12422470B2Semiconductor packages with through via structures and methods for testing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1771US9312759B2Self-adjusting regulator and method of using sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 12, 2016·3 cites·21 claims
- 1869US9236856B2Apparatus for controlling slew rateSHI JUSTIN·Filed 2010·Granted Jan 12, 2016·3 cites·19 claims
- 1967US11075136B2Heat transfer structures and methods for IC packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 2065US11450595B2Semiconductor package device with integrated inductor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 2160US10559517B2Heat transfer structures and methods for IC packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 2257US2023261572A1Power delivery for multi-chip-package using in-package voltage regulatorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2356US10163751B2Heat transfer structures and methods for IC packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·15 claims
- 2454US11271482B2DC-DC converter and DC-DC converter operation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·19 claims
- 2549US9325296B2Buffer offset modulationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 26, 2016·0 cites·20 claims
- 2647US11204614B2Current balance circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 21, 2021·0 cites·20 claims
- 2747US8847800B2Buffer offset modulationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 30, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →