Inventor · disambiguated record
Yi-Sung Hwang
Also filed as: HWANG YI-SUNG
5 granted patents·1 pending application·113 citations·filing 2002–2015
78Inventor score
Top patents by PatentIndex Score
6 records- 0196US7850087B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 14, 2010·100 cites·39 claims
- 0265US7502231B2Thin printed circuit board for manufacturing chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 10, 2009·3 cites·7 claims
- 0353US6653727B2Semiconductor chip package with direction-flexible mountabilitySAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 25, 2003·6 cites·20 claims
- 0449US7323642B2Thin printed circuit board for manufacturing chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 29, 2008·4 cites·11 claims
- 0530US8420945B2Package substrate, semiconductor package having the package substrateHWANG YI-SUNG·Filed 2010·Granted Apr 16, 2013·0 cites·8 claims
- 0629US2016086828A1Magazine and process equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →