Inventor · disambiguated record
Yih-Jenn Jiang
Also filed as: JIANG YIH-JENN
10 granted patents·11 pending applications·44 citations·filing 2006–2024
85Inventor score
Top patents by PatentIndex Score
21 records- 0196US11764188B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Sep 19, 2023·7 cites·10 claims
- 0293US7638879B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 29, 2009·26 cites·9 claims
- 0391US12255182B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Mar 18, 2025·1 cites·14 claims
- 0474US8519526B2Semiconductor package and fabrication method thereofHUANG JUNG-PANG·Filed 2011·Granted Aug 27, 2013·5 cites·6 claims
- 0572US7993967B2Semiconductor package fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2009·Granted Aug 9, 2011·4 cites·16 claims
- 0671US2025038088A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0764US12159821B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·24 claims
- 0861US8895367B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 25, 2014·1 cites·10 claims
- 0959US12414232B2Substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·8 claims
- 1059US2025087635A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1155US2025266393A1Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1253US2019214372A1Method for fabricating electronic package having a shielding layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Application pending·0 cites
- 1351US2024266335A1Electronic package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1448US2018068983A1Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1546US11791300B2Electronic package and circuit structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·11 claims
- 1646US10192838B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jan 29, 2019·0 cites·9 claims
- 1746US2024234272A9Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 1845US2022189900A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Application pending·0 cites
- 1942US2007178627A1Flip-chip semiconductor device and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 2039US2013113095A1Packaging substrate and fabrication method thereofCHUANG CHIEN-LUNG·Filed 2012·Application pending·0 cites
- 2131US2012129315A1Method for fabricating semiconductor packageHU YEH-CHANG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →