Inventor · disambiguated record
Yinuo Jin
Also filed as: JIN YINUO
18 granted patents·2 pending applications·22 citations·filing 2012–2023
89Inventor score
Top patents by PatentIndex Score
20 records- 0190US11581205B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Feb 14, 2023·2 cites·42 claims
- 0289US9558985B2Vacuum chuckWANG JIAN·Filed 2012·Granted Jan 31, 2017·11 cites·19 claims
- 0386US11141762B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Oct 12, 2021·3 cites·42 claims
- 0481US11911808B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2023·Granted Feb 27, 2024·0 cites·40 claims
- 0578US11037804B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2016·Granted Jun 15, 2021·2 cites·33 claims
- 0677US11257667B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Feb 22, 2022·2 cites·27 claims
- 0776US12467156B2Plating apparatus and plating methodACM RESEARCH SHANGHAI INC·Filed 2023·Granted Nov 11, 2025·0 cites·10 claims
- 0875US11633765B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Apr 25, 2023·0 cites·14 claims
- 0974US10910244B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2015·Granted Feb 2, 2021·2 cites·35 claims
- 1070US11967497B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2022·Granted Apr 23, 2024·0 cites·16 claims
- 1164US11848217B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted Dec 19, 2023·0 cites·37 claims
- 1264US11638937B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted May 2, 2023·0 cites·52 claims
- 1360US11752529B2Method for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Sep 12, 2023·0 cites·23 claims
- 1459US2024279838A1Electroplating device and electroplating methodACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 1557US11781235B2Plating apparatus and plating methodACM RESEARCH SHANGHAI INC·Filed 2018·Granted Oct 10, 2023·0 cites·10 claims
- 1656US2024035189A1Cup-shaped chuck of substrate holding device and substrate holding deviceACM RESEARCH SHANGHAI INC·Filed 2021·Application pending·0 cites
- 1754US10227705B2Apparatus and method for plating and/or polishing waferACM RESEARCH SHANGHAI INC·Filed 2013·Granted Mar 12, 2019·0 cites·21 claims
- 1851US11103898B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2016·Granted Aug 31, 2021·0 cites·43 claims
- 1944US9724803B2Nozzle for stress-free polishing metal layers on semiconductor wafersWANG JIAN·Filed 2012·Granted Aug 8, 2017·0 cites·20 claims
- 2042US9865476B2Method and apparatus for pulse electrochemical polishingWANG JIAN·Filed 2012·Granted Jan 9, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →