Inventor · disambiguated record
Ying-Hao Kuo
Also filed as: KUO YING-HAO
87 granted patents·1 pending application·186 citations·filing 2006–2021
99Inventor score
Top patents by PatentIndex Score
88 records- 0196US9041015B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·17 cites·21 claims
- 0294US11658044B2Thermally conductive structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 0394US9618712B2Optical bench on substrate and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·10 cites·20 claims
- 0492US9576930B2Thermally conductive structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 21, 2017·10 cites·19 claims
- 0592US9335473B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 10, 2016·7 cites·20 claims
- 0692US8976833B2Light coupling device and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 10, 2015·11 cites·20 claims
- 0791US7489439B2Semiconductor Raman ring amplifierINTEL CORP·Filed 2006·Granted Feb 10, 2009·14 cites·13 claims
- 0890US9857309B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·3 cites·20 claims
- 0990US9405063B2Integrated metal gratingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 2, 2016·6 cites·20 claims
- 1089US10161875B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 1189US9419156B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·6 cites·18 claims
- 1288US9575249B2Method of making a metal grating in a waveguide and device formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 21, 2017·6 cites·20 claims
- 1386US10177082B2Method for forming semiconductor package using carbon nano material in molding compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·3 cites·20 claims
- 1486US9806069B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·3 cites·20 claims
- 1586US9484211B2Etchant and etching processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 1, 2016·5 cites·20 claims
- 1686US9423578B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·5 cites·20 claims
- 1785US9478939B2Light coupling device and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·4 cites·20 claims
- 1885US9244223B2Light coupling formation in a waveguide layerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 26, 2016·3 cites·20 claims
- 1984US10276471B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 2084US10156741B2Electro-optic modulator device, optical device and method of making an optical deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·2 cites·20 claims
- 2184US9478475B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·3 cites·20 claims
- 2284US9410893B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·5 cites·20 claims
- 2383US10527788B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 7, 2020·2 cites·20 claims
- 2482US10748825B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·2 cites·20 claims
- 2582US10353147B2Etchant and etching process for substrate of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 16, 2019·2 cites·20 claims
- 2682US10061079B2Method of making a metal grating in a waveguide and device formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·2 cites·20 claims
- 2782US9876127B2Backside-illuminated photodetector structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 23, 2018·3 cites·20 claims
- 2882US9488779B2Apparatus and method of forming laser chip package with waveguide for light couplingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 8, 2016·4 cites·20 claims
- 2982US8922900B2Optical element structure and optical element fabricating process for the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 30, 2014·5 cites·20 claims
- 3080US10261248B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 16, 2019·2 cites·20 claims
- 3180US9099623B2Manufacture including substrate and package structure of optical chipTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·3 cites·21 claims
- 3280US8828484B2Self-alignment due to wettability difference of an interfaceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 9, 2014·4 cites·16 claims
- 3379US9093449B2Apparatus and method for chip placement and moldingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·4 cites·20 claims
- 3478US10866361B2Method of making a metal grating in a waveguide and device formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 3578US9960099B2Thermally conductive molding compound structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 1, 2018·4 cites·20 claims
- 3678US7760422B2Semiconductor raman ring amplifierINTEL CORP·Filed 2008·Granted Jul 20, 2010·4 cites·9 claims
- 3776US11060977B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 3875US10510707B2Thermally conductive molding compound structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 3974US9413140B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·2 cites·20 claims
- 4073US11574886B2Thermally conductive molding compound structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 4173US10508993B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 4272US9228896B2Optical spectroscopy device, process of making the same, and method of using the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 5, 2016·2 cites·20 claims
- 4371US11415762B2Optical bench, method of making and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 4471US9383513B2Waveguide structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 5, 2016·2 cites·20 claims
- 4570US9902092B2Vacuum carrier module, method of using and process of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 27, 2018·2 cites·19 claims
- 4670US9568677B2Waveguide structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·2 cites·20 claims
- 4769US9651736B2Self-alignment due to wettability difference of an interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·0 cites·20 claims
- 4869US9490148B2Adhesion promoter apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Nov 8, 2016·2 cites·20 claims
- 4967US9490133B2Etching apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 8, 2016·1 cites·20 claims
- 5067US9368375B2Apparatus and method for self-aligning chip placement and levelingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1 cites·25 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →