Inventor · disambiguated record
Yi Eok Kwon
Also filed as: KWON YI EOK
0 granted patents·4 pending applications·0 citations·filing 2018–2023
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0158US2024258274A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0257US2024258277A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0355US2024213113A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0439US2019229070A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →