Inventor · disambiguated record
Yieok Kwon
Also filed as: KWON YIEOK
4 granted patents·1 pending application·7 citations·filing 2019–2023
64Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0192US11569175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·5 cites·20 claims
- 0268US10930525B2Carrier substrate and method of manufacturing semiconductor package using the carrier substrateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·2 cites·15 claims
- 0366US12119305B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0453US2024222284A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0550US11398420B2Semiconductor package having core member and redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →