Inventor · disambiguated record
Yin Lai
Also filed as: LAI YIN M · LAI YIN MEN
2 granted patents·1 pending application·9 citations·filing 2003–2007
49Inventor score
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0153US7262077B2Capillary underfill and mold encapsulation method and apparatusINTEL CORP·Filed 2003·Granted Aug 28, 2007·9 cites·27 claims
- 0240US2008017976A1Capillary underfill and mold encapsulation method and apparatusINTEL CORP·Filed 2007·Application pending·0 cites
- 0329US7470984B2Perpendicularly oriented electrically active element method and systemINTEL CORP·Filed 2006·Granted Dec 30, 2008·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →