Inventor · disambiguated record
Yi-Jen Lai
Also filed as: LAI YI-JEN
35 granted patents·4 pending applications·78 citations·filing 2010–2024
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD31CHOU YOU-HUA2LAI YI-JEN2TAIWAN SEMICONDUCTOR MFG2CHEN YU-REN1
Top patents by PatentIndex Score
39 records- 0195US10276548B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·11 cites·20 claims
- 0292US10510734B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 0390US8916969B2Semiconductor devices, packaging methods and structuresCHEN YU-REN·Filed 2011·Granted Dec 23, 2014·14 cites·15 claims
- 0489US10522526B2LTHC as charging barrier in InFO package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·5 cites·20 claims
- 0588US10867976B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 0686US10546845B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 28, 2020·3 cites·20 claims
- 0785US12334489B2Lthc as charging barrier in info package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 0884US8610270B2Semiconductor device and semiconductor assembly with lead-free solderLAI YI-JEN·Filed 2010·Granted Dec 17, 2013·8 cites·19 claims
- 0982US12051634B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1082US10090267B2Bump structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 2, 2018·5 cites·20 claims
- 1182US2024355795A1Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1280US11437361B2LTHC as charging barrier in InFO package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 6, 2022·2 cites·20 claims
- 1380US10573573B2Package and package-on-package structure having elliptical conductive columnsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·20 claims
- 1480US9735123B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·5 cites·20 claims
- 1579US10163843B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 1678US11923353B2LTHC as charging barrier in info package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 1777US9997482B2Solder stud structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 12, 2018·4 cites·20 claims
- 1876US11756849B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
- 1975US12046588B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 2073US8541262B2Die edge contacts for semiconductor devicesLAI YI-JEN·Filed 2010·Granted Sep 24, 2013·3 cites·19 claims
- 2172US9806046B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·2 cites·20 claims
- 2270US11404341B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 2370US8941232B2Metal bumps for cooling device connectionCHOU YOU-HUA·Filed 2011·Granted Jan 27, 2015·2 cites·20 claims
- 2469US11488891B2Method of forming conductive bumps for cooling device connection and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 2566US9899296B2Method of forming conductive bumps for cooling device connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·1 cites·20 claims
- 2665US10290590B2Stacked semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·18 claims
- 2764US11257797B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 2859US11217548B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 4, 2022·0 cites·20 claims
- 2959US10651111B2Method of forming conductive bumps for cooling device connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 12, 2020·0 cites·20 claims
- 3059US2023193436A1Stainless steel powder composition, preparing method thereof and method of preparing stainless steel workpiece by laser additive manufacturingCHUNG YO MAT CO LTD·Filed 2022·Application pending·0 cites
- 3155US9594096B2Probe card for simultaneously testing multiple diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 14, 2017·0 cites·20 claims
- 3255US9190347B2Die edge contacts for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 17, 2015·0 cites·20 claims
- 3354US11145613B2Method for forming bump structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 12, 2021·0 cites·20 claims
- 3453US8952534B2Semiconductor device and semiconductor assembly with lead-free solderTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·0 cites·19 claims
- 3553US2015262952A1Bump structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Application pending·0 cites
- 3652US2018033756A1Method for forming bump structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Application pending·0 cites
- 3750US8564319B2Probe card for simultaneously testing multiple diesCHOU YOU-HUA·Filed 2010·Granted Oct 22, 2013·0 cites·16 claims
- 3845US9779969B2Package structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·0 cites·20 claims
- 3940US11201142B2Semiconductor package, package on package structure and method of froming package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 14, 2021·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →