Inventor · disambiguated record
Yi-Jyun Lee
Also filed as: LEE YI-JYUN
2 granted patents·1 pending application·1 citations·filing 2021–2023
30Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0184US12300679B2Semiconductor package structureMEDIATEK INC·Filed 2022·Granted May 13, 2025·1 cites·19 claims
- 0250US2023422526A1Semiconductor package structureMEDIATEK SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 0349US11887976B2Land-side silicon capacitor design and semiconductor package using the sameMEDIATEK INC·Filed 2021·Granted Jan 30, 2024·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →