Inventor · disambiguated record
Yit Meng Lee
Also filed as: LEE YIT MENG
3 granted patents·11 pending applications·1 citations·filing 2009–2025
47Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0161US2025062217A1Packaged semiconductor device and method of manufacturingNXP USA INC·Filed 2024·Application pending·0 cites
- 0260US2025112128A1Packaged semiconductor device and method of making thereofNXP USA INC·Filed 2024·Application pending·0 cites
- 0360US2025132212A1Qfn packaged semiconductor device and methodNXP USA INC·Filed 2024·Application pending·0 cites
- 0459US2025006596A1Qfn packaged semiconductor device and method of making thereofNXP USA INC·Filed 2024·Application pending·0 cites
- 0558US2024413030A1Packaged semiconductor device and method of manufacturingNXP USA INC·Filed 2024·Application pending·0 cites
- 0658US2024413065A1Packaged semiconductor devices and methods of making the sameNXP USA INC·Filed 2024·Application pending·0 cites
- 0756US11984408B2Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formationNXP USA INC·Filed 2021·Granted May 14, 2024·0 cites·19 claims
- 0853US2025385173A1Packaged semiconductor device and method for packagingNXP USA INC·Filed 2025·Application pending·0 cites
- 0951US7989965B2Underfill dispensing system for integrated circuitsFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Aug 2, 2011·1 cites·18 claims
- 1051US2023097173A1Type of bumpless and wireless semiconductor deviceNXP USA INC·Filed 2022·Application pending·0 cites
- 1150US2023068886A1Packaged semiconductor device, leadframe and method for improved bondingNXP USA INC·Filed 2022·Application pending·0 cites
- 1239US10734327B2Lead reduction for improved creepage distanceNXP USA INC·Filed 2019·Granted Aug 4, 2020·0 cites·21 claims
- 1334US2012073859A1Polymer core wireLO WAI YEW·Filed 2010·Application pending·0 cites
- 1430US2014374892A1Lead frame and semiconductor device using sameLEE YIT MENG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →