Inventor · disambiguated record
Yi Li
Also filed as: LI YI · LI YI X · LI YÍ · Li yi-xuan
9 granted patents·8 pending applications·84 citations·filing 2005–2024
86Inventor score
Top patents by PatentIndex Score
17 records- 0193US9704735B2Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabricationKONCHADY MANOHAR S·Filed 2014·Granted Jul 11, 2017·21 cites·25 claims
- 0293US7800868B2Magnetic sensing device including a sense enhancing layerSEAGATE TECHNOLOGY LLC·Filed 2005·Granted Sep 21, 2010·33 cites·4 claims
- 0390US7929259B2Magnetic sensing device including a sense enhancing layerSEAGATE TECHNOLOGY LLC·Filed 2010·Granted Apr 19, 2011·9 cites·18 claims
- 0487US10629469B2Solder resist layers for coreless packages and methods of fabricationINTEL CORP·Filed 2017·Granted Apr 21, 2020·4 cites·4 claims
- 0586US8138239B2Polymer thermal interface materialsPRACK ED·Filed 2008·Granted Mar 20, 2012·15 cites·12 claims
- 0680US11443970B2Methods of forming a package substrateINTEL CORP·Filed 2020·Granted Sep 13, 2022·1 cites·7 claims
- 0766US11456281B2Architecture and processes to enable high capacity memory packages through memory die stackingINTEL CORP·Filed 2018·Granted Sep 27, 2022·1 cites·16 claims
- 0857US12400363B2Device and method for improved fiducial marker detectionINTEL CORP·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 0957US2025006609A1Methods and apparatus for package substrates with stacks of glass layers having different coefficients of thermal expansionINTEL CORP·Filed 2024·Application pending·0 cites
- 1055US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1155US2025192070A1Microelectronic assemblies with post-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1253US2025210586A1Semiconductor package substrate dicing and edge passivationINTEL CORP·Filed 2023·Application pending·0 cites
- 1353US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 1451US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1547US2024258420A1Semiconductor deviceLi yi xuan·Filed 2024·Application pending·0 cites
- 1646US2024178151A1Overlying fiducial design for glass placement accuracy improvementINTEL CORP·Filed 2022·Application pending·0 cites
- 1745US10957667B2Indium solder metallurgy to control electro-migrationINTEL CORP·Filed 2016·Granted Mar 23, 2021·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →