Inventor · disambiguated record
Yi-Huan Liao
Also filed as: LIAO YI-HUAN
6 granted patents·8 pending applications·7 citations·filing 2016–2025
70Inventor score
Top patents by PatentIndex Score
14 records- 0185US9690971B2Photo-sensing unit, photo-sensing apparatus, and method for fabricating photo-sensing unitAU OPTRONICS CORP·Filed 2016·Granted Jun 27, 2017·7 cites·16 claims
- 0279US2025364355A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0371US12494401B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 0471US12463108B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 0570US12120898B2Photosensitive deviceAUO CORP·Filed 2023·Granted Oct 15, 2024·0 cites·11 claims
- 0663US11832462B2Photosensitive deviceAU OPTRONICS CORP·Filed 2021·Granted Nov 28, 2023·0 cites·9 claims
- 0760US2025349631A1Package structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0860US2025349665A1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0959US2025233098A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1056US2025054824A1Package structure having dam structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1156US2025174510A1Structure and formation method of package with heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1256US2023307094A1Method for predicting cancer prognosis and model thereforUNIV NAT CHENG KUNG·Filed 2022·Application pending·0 cites
- 1353US2024038623A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1445US10849533B2Blood vessel scanning system and methodAU OPTRONICS CORP·Filed 2018·Granted Dec 1, 2020·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →