Inventor · disambiguated record
Yi-Tzeng Lin
Also filed as: LIN YI-TZENG
3 granted patents·3 pending applications·2 citations·filing 2022–2024
49Inventor score
Technology areasH10W
Files withGLOBAL UNICHIP CORP6
Top patents by PatentIndex Score
6 records- 0187US11869846B1Interposer routing structure and semiconductor packageGLOBAL UNICHIP CORP·Filed 2023·Granted Jan 9, 2024·2 cites·20 claims
- 0256US2025349695A1Substrate structure and semiconductor packageGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0356US2025385191A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0455US2025226330A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0553US11869845B2Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 0649US12506057B2Interposer device and semiconductor package structureGLOBAL UNICHIP CORP·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Yi-Tzeng Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →