Inventor · disambiguated record
Yi-Jou Lin
Also filed as: LIN YI-JOU
37 granted patents·4 pending applications·1,781 citations·filing 2012–2024
97Inventor score
Files withMEDIATEK INC21TAIWAN SEMICONDUCTOR MFG CO LTD13LIN YI-JOU2TAIWAN SEMICONDUCTOR MFG2JAU LAANG IND CO LTD1
Top patents by PatentIndex Score
41 records- 0199US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
- 0299US8680647B2Packages with passive devices and methods of forming the sameYU CHEN-HUA·Filed 2012·Granted Mar 25, 2014·594 cites·20 claims
- 0398US9460987B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·22 cites·20 claims
- 0497US12183723B2Semiconductor package with dummy MIM capacitor dieMEDIATEK INC·Filed 2022·Granted Dec 31, 2024·3 cites·12 claims
- 0597US9922903B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·12 cites·20 claims
- 0695US11854930B2Semiconductor chip package and fabrication method thereofMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·2 cites·18 claims
- 0795US11222850B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2020·Granted Jan 11, 2022·4 cites·17 claims
- 0894US11830820B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2021·Granted Nov 28, 2023·2 cites·14 claims
- 0994US10269685B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 1092US11037861B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·4 cites·20 claims
- 1192US9040381B2Packages with passive devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·11 cites·20 claims
- 1291US11469152B2Semiconductor chip package and fabrication method thereofMEDIATEK INC·Filed 2020·Granted Oct 11, 2022·2 cites·18 claims
- 1390US10354988B2Using metal-containing layer to reduce carrier shock in package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·5 cites·20 claims
- 1489US11508707B2Semiconductor package with dummy MIM capacitor dieMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·2 cites·20 claims
- 1589US10515875B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 24, 2019·3 cites·20 claims
- 1687US11646295B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2021·Granted May 9, 2023·1 cites·18 claims
- 1786US11171113B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2019·Granted Nov 9, 2021·3 cites·17 claims
- 1886US10083949B2Using metal-containing layer to reduce carrier shock in package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 25, 2018·4 cites·20 claims
- 1985US11302592B2Semiconductor package having a stiffener ringMEDIATEK INC·Filed 2018·Granted Apr 12, 2022·4 cites·16 claims
- 2084US2025105077A1Package-on-package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2183US10025092B1Projector and projecting lens thereofJAU LAANG IND CO LTD·Filed 2017·Granted Jul 17, 2018·7 cites·14 claims
- 2282US2024387308A1Manufacturing method of package-on-package structure and manufacturing method of integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2380US11264337B2Semiconductor package structureMEDIATEK INC·Filed 2019·Granted Mar 1, 2022·2 cites·18 claims
- 2479US12388026B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2023·Granted Aug 12, 2025·0 cites·16 claims
- 2579US12142598B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 2674US9448464B2Projector and projecting lens of the projectorLIN YI-JOU·Filed 2014·Granted Sep 20, 2016·4 cites·15 claims
- 2773US12198996B2Integrated fan-out package, package-on-package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 2871US11862578B2Semiconductor package structureMEDIATEK INC·Filed 2022·Granted Jan 2, 2024·0 cites·17 claims
- 2968US11728232B2Semiconductor package having a stiffener ringMEDIA TEK INC·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 3067US10290605B2Fan-out package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·16 claims
- 3165US10290590B2Stacked semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·18 claims
- 3264US12334444B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2022·Granted Jun 17, 2025·0 cites·11 claims
- 3361US12444715B2Semiconductor package structureMEDIATEK INC·Filed 2023·Granted Oct 14, 2025·0 cites·14 claims
- 3459US9417443B2Projector, projecting lens of the projector and method of projecting imagesLIN YI-JOU·Filed 2014·Granted Aug 16, 2016·1 cites·16 claims
- 3558US11670596B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 3658US11075132B2Integrated fan-out package, package-on-package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·0 cites·20 claims
- 3755US11830851B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Nov 28, 2023·0 cites·14 claims
- 3855US2025210568A1Redistribution layer structure for high-density semiconductor package assemblyMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3954US11342267B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2019·Granted May 24, 2022·0 cites·5 claims
- 4054US2023060065A1Lidded semiconductor packageMEDIATEK INC·Filed 2022·Application pending·0 cites
- 4152US12021031B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Jun 25, 2024·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →