Inventor · disambiguated record
Yi-Ling Liu
Also filed as: LIU YI · LIU YI-LING
19 granted patents·14 pending applications·62 citations·filing 2006–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12APEX MEDICAL CORP3POWER QUOTIENT INT CO LTD3WIN SEMICONDUCTORS CORP3CHIU KUEI-YING2
Top patents by PatentIndex Score
33 records- 0196US11888074B2Flash memory device with three-dimensional half flash structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 30, 2024·2 cites·20 claims
- 0293US2025366072A1Flash memory device with three-dimensional half flash structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0389US2025126848A1Flash Memory Device with Three Dimensional Half Flash Structure and Methods for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0488US7644867B2Business card sized storage devicePOWER QUOTIENT INT CO LTD·Filed 2007·Granted Jan 12, 2010·32 cites·7 claims
- 0587US12402362B2Flash memory device with three-dimensional half structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 0687US11658248B2Flash memory device with three-dimensional half flash structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·1 cites·20 claims
- 0786US11201066B2Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2018·Granted Dec 14, 2021·2 cites·6 claims
- 0884US12218253B2Flash memory device with three dimensional half flash structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0982US7685363B2Low profile storage devicePOWER QUOTIENT INT CO LTD·Filed 2006·Granted Mar 23, 2010·16 cites·11 claims
- 1078US2025357429A1Interconnect Structure for Front-to-Front Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1178US2022130686A1Control of under-fill using an encapsulant and a trench or dam for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2021·Application pending·0 cites
- 1276US2025349675A1Semiconductor devices with backside interconnect structure and through via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1372USD1077379SRemote transmitter for dog training collarDONGGUAN LINSHEN TECH CO LTD·Filed 2023·Granted May 27, 2025·5 cites·1 claims
- 1470US2025046756A1Interconnect Structure for Front-to-Front Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1569US2025038074A1Semiconductor devices with backside interconnect structure and through via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1663US12290050B2Intelligent pet ecosystemSMART PETS HOME INC·Filed 2024·Granted May 6, 2025·0 cites·10 claims
- 1762US12408624B2Folding unit structure and pet houseSMART PETS HOME INC·Filed 2024·Granted Sep 9, 2025·0 cites·6 claims
- 1862US7732921B2Window type BGA semiconductor package and its substratePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jun 8, 2010·4 cites·15 claims
- 1958US2025132246A1Semiconductor structures with backside power delivery networkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2050US2010268399A1Method for operating air mattress controller and structure thereofTSAI CHEN-HUNG·Filed 2009·Application pending·0 cites
- 2148US11195841B2Integrated circuit and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 2246US2017178522A1Interactive education deviceLIU YI-LING·Filed 2015·Application pending·0 cites
- 2345US8557496B2Chemical toner composition and method for preparing the sameCHIU KUEI-YING·Filed 2012·Granted Oct 15, 2013·0 cites·20 claims
- 2444US2009096070A1Semiconductor package and substrate for the samePOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 2542US10498310B2Protective cover for an acoustic wave device and fabrication method thereofWIN SEMICONDUCTORS CORP·Filed 2016·Granted Dec 3, 2019·0 cites·10 claims
- 2642US2008179720A1Lead frame for chip packages with wire-bonding at single-side padsPOWERTCH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 2742US2007143544A1Low profile card reading devicePOWER QUOTIENT INT CO LTD·Filed 2006·Application pending·0 cites
- 2840US8822117B2Chemical toner composition and method for preparing the sameCHIU KUEI-YING·Filed 2008·Granted Sep 2, 2014·0 cites·16 claims
- 2938US10709255B2Inflation identification connector and air mattress system having sameAPEX MEDICAL CORP·Filed 2018·Granted Jul 14, 2020·0 cites·5 claims
- 3038US10675199B2Patient support structure, pressure relief module and non-powered pressure regulation methodAPEX MEDICAL CORP·Filed 2017·Granted Jun 9, 2020·0 cites·7 claims
- 3134US9991198B2Layout method for compound semiconductor integrated circuitsWIN SEMICONDUCTORS CORP·Filed 2016·Granted Jun 5, 2018·0 cites·30 claims
- 3234US2017272052A1Protective Cover for an Acoustic Wave Device and Fabrication Method ThereofWIN SEMICONDUCTORS CORP·Filed 2017·Application pending·0 cites
- 3325USD847352SMedical supporting cushionAPEX MEDICAL CORP·Filed 2017·Granted Apr 30, 2019·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →