Inventor · disambiguated record
Yi-Hsin Pao
Also filed as: PAO YI-HSIN
5 granted patents·230 citations·filing 1993–1997
83Inventor score
Top patents by PatentIndex Score
5 records- 0187US5931371AStandoff controlled interconnectionFORD MOTOR CO·Filed 1997·Granted Aug 3, 1999·117 cites·18 claims
- 0285US5386343ADouble surface mount technology for electronic packagingFORD MOTOR CO·Filed 1993·Granted Jan 31, 1995·66 cites·16 claims
- 0368US5936846AOptimized solder joints and lifter pads for improving the solder joint life of surface mount chipsFORD GLOBAL TECH·Filed 1997·Granted Aug 10, 1999·31 cites·21 claims
- 0446US5736786APower module with silicon dice oriented for improved reliabilityFORD GLOBAL TECH INC·Filed 1996·Granted Apr 7, 1998·16 cites·18 claims
- 0524US5813884AMeniscus-shape terminations for leadless electronic componentsFORD GLOBAL TECH INC·Filed 1997·Granted Sep 29, 1998·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →