Inventor · disambiguated record

Yingjun Pi

Also filed as: Pi Yingjun

1 granted patent·1 pending application·0 citations·filing 2018–2018

1Inventor score

Technology areasH10W

Files withSHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP LP2

Top patents by PatentIndex Score

2 records

0128US11710646B2Fan-out packaging method and fan-out packaging plateSHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP LP·Filed 2018·Granted Jul 25, 2023·0 cites·15 claims
0226US2021358883A1Fan-out packaging method employing combined processSHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP LP·Filed 2018·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →