Inventor · disambiguated record
Yingjiang Pu
Also filed as: Pu Yingjiang
6 granted patents·7 pending applications·0 citations·filing 2021–2025
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0165US12266583B2Flip chip package unit and associated packaging methodCHENGDU MONOLITHIC POWER SYS·Filed 2022·Granted Apr 1, 2025·0 cites·12 claims
- 0264US2025246445A1Flip chip package unit and associated packaging methodCHENGDU MONOLITHIC POWER SYS·Filed 2025·Application pending·0 cites
- 0360US12002787B2Multi-die package structure and multi-die co-packing methodCHENGDU MONOLITHIC POWER SYS·Filed 2021·Granted Jun 4, 2024·0 cites·12 claims
- 0456US2024321711A1Substrate and a method for manufacturing the sameCHENGDU MONOLITHIC POWER SYS·Filed 2024·Application pending·0 cites
- 0555US2025096209A1Double-side-cooling power moduleMONOLITHIC POWER SYSTEMS INC·Filed 2023·Application pending·0 cites
- 0651US12159792B2Flip chip package unit comprising thermal protection film and associated packaging methodCHENGDU MONOLITHIC POWER SYS·Filed 2022·Granted Dec 3, 2024·0 cites·6 claims
- 0750US11670600B2Panel level metal wall grids array for integrated circuit packagingCHENGDU MONOLITHIC POWER SYS·Filed 2021·Granted Jun 6, 2023·0 cites·11 claims
- 0850US11616017B2Integrated circuit package structure, integrated circuit package unit and associated packaging methodCHENGDU MONOLITHIC POWER SYS·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 0949US11824001B2Integrated circuit package structure and integrated circuit package unitCHENGDU MONOLITHIC POWER SYS·Filed 2021·Granted Nov 21, 2023·0 cites·17 claims
- 1048US2022208732A1Multi-die co-packed module and multi-die co-packing methodCHENGDU MONOLITHIC POWER SYS·Filed 2021·Application pending·0 cites
- 1148US2025253767A1Power module with passive component layerMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 1248US2022199581A1Multi-die package structure and multi-die co-packing methodCHENGDU MONOLITHIC POWER SYS·Filed 2021·Application pending·0 cites
- 1347US2022208714A1Integrated circuit package structure, integrated circuit package unit and associated packaging methodCHENGDU MONOLITHIC POWER SYS·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →