Inventor · disambiguated record
Ying Pok Sam
Also filed as: SAM YING POK
1 granted patent·1 pending application·0 citations·filing 2020–2022
10Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG2
Top patents by PatentIndex Score
2 records- 0151US2023230903A1Semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0247US11211356B2Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →