Inventor · disambiguated record
Yi-Feng Shih
Also filed as: SHIH YI-FENG · SHIH YI-FENG FU
12 granted patents·4 pending applications·16 citations·filing 2012–2023
86Inventor score
Top patents by PatentIndex Score
16 records- 0196US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0286US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 0385US2024063339A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSAMILEDS CORP·Filed 2023·Application pending·0 cites
- 0481US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 0580US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 0677US9537073B2Method for fabricating a light emitting diode (LED) die having strap layerSEMILEDS OPTOELECTRONICS CO·Filed 2016·Granted Jan 3, 2017·2 cites·11 claims
- 0774US9437794B2Method of fabricating a flip chip light emitting diode (FCLED) die having N-conductor layerSEMILEDS OPTOELECTRONICS CO·Filed 2016·Granted Sep 6, 2016·1 cites·10 claims
- 0872US12426410B2Semiconductor components and semiconductor structures and methods of fabricationTSLC CORP·Filed 2020·Granted Sep 23, 2025·0 cites·22 claims
- 0971US9419195B2Light emitting diode (LED) die having strap layer and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted Aug 16, 2016·1 cites·15 claims
- 1055US2022320366A1Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth SubstrateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 1153US2023018855A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 1250USD695699SElectrodeSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Dec 17, 2013·7 cites·1 claims
- 1343US9231152B2Light emitting diodeSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Jan 5, 2016·0 cites·5 claims
- 1442US9190589B2Light emitting diodeSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Nov 17, 2015·0 cites·7 claims
- 1540US9653435B2Light emitting diode (LED) package having short circuit (VLED) die, lens support dam and same side electrodes and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2015·Granted May 16, 2017·0 cites·13 claims
- 1624USD689832SLight emitting diodeSHIH YI-FENG·Filed 2012·Granted Sep 17, 2013·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →