Inventor · disambiguated record
Yi-Nien Su
Also filed as: SU YI · SU YI J · SU YI-NIEN
51 granted patents·17 pending applications·269 citations·filing 2001–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD40TAIWAN SEMICONDUCTOR MFG17XEROX CORP6SU YI-NIEN2HSU JU-WANG1
Top patents by PatentIndex Score
68 records- 0198US9881794B1Semiconductor methods and devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·31 cites·20 claims
- 0296US11715640B2Patterning material including silicon-containing layer and method for semiconductor device fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·3 cites·20 claims
- 0394US12388008B2Semiconductor interconnect structure with bottom self-aligned via landingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 12, 2025·2 cites·20 claims
- 0490US10867840B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·5 cites·20 claims
- 0587US10867804B2Patterning method for semiconductor device and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·4 cites·20 claims
- 0687US6658179B2Monolithic reconfigurable optical multiplexer systems and methodsXEROX CORP·Filed 2001·Granted Dec 2, 2003·34 cites·16 claims
- 0785US11456210B2Integrated circuit and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·1 cites·20 claims
- 0885US9041216B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·6 cites·20 claims
- 0985US2025336717A1Air spacer surrounding conductive features and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1084US11710657B2Middle-of-line interconnect structure having air gap and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·1 cites·20 claims
- 1183US10276381B2Semiconductor methods and devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·2 cites·20 claims
- 1282US12237214B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1382US9129965B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 8, 2015·4 cites·20 claims
- 1482US7015133B2Dual damascene structure formed of low-k dielectric materialsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 21, 2006·31 cites·20 claims
- 1581US12205824B2Patterning material including silicon-containing layer and method for semiconductor device fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1681US6797627B1Dry-wet-dry solvent-free process after stop layer etch in dual damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 28, 2004·35 cites·14 claims
- 1780US12153350B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 1880US9425091B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·2 cites·20 claims
- 1980US7094689B2Air gap interconnect structure and method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 22, 2006·23 cites·24 claims
- 2080US2025044708A1Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2180US2025329578A1Method for reducing line end spacing and semicondcutor devices manufactured thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2279US2024379414A1Air spacer surrounding conductive features and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2378US9530728B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·2 cites·20 claims
- 2478US8927353B2Fin field effect transistor and method of forming the sameHSU JU-WANG·Filed 2007·Granted Jan 6, 2015·8 cites·17 claims
- 2578US7217663B2Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 15, 2007·7 cites·14 claims
- 2678US2025132204A1Self-aligned via formation using spacersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2777US12142520B2Middle-of-line interconnect structure having air gap and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 2877US11735469B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 2977US2025087496A1Methods for fabricating semicondcutor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3076US12183628B2Integrated circuit and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 3176US12014952B2Lithography method to reduce spacing between interconnect wires in interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 3276US11796922B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 24, 2023·1 cites·10 claims
- 3376US2024387357A1Semiconductor interconnect structure with bottom self-aligned via landingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3476US2024387255A1Device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3575US2023360966A1Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3672US6510275B1Micro-optoelectromechanical system based device with aligned structures and method for fabricating sameXEROX CORP·Filed 2001·Granted Jan 21, 2003·14 cites·20 claims
- 3772US2025167000A1Patterning material including silicon-containing layer and method for semiconductor device fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3871US12165914B2Air spacer surrounding conductive features and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 3971US11322393B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 4071US6861341B2Systems and methods for integration of heterogeneous circuit devicesXEROX CORP·Filed 2002·Granted Mar 1, 2005·14 cites·16 claims
- 4168US10483397B2Fin field effect transistor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 19, 2019·1 cites·20 claims
- 4267US12218007B2Self-aligned via formation using spacersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 4367US12170205B2Methods for fabricating semiconductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·20 claims
- 4466US7029992B2Low oxygen content photoresist stripping process for low dielectric constant materialsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 18, 2006·9 cites·17 claims
- 4566US6828251B2Method for improved plasma etching controlTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 7, 2004·12 cites·12 claims
- 4666US2023268225A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4765US12412778B2Method for reducing line end spacing and semiconductor devices manufactured thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 4865US6990265B2Monolithic reconfigurable optical multiplexer systems and methodsXEROX CORP·Filed 2003·Granted Jan 24, 2006·8 cites·19 claims
- 4964US11355642B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·20 claims
- 5063US11728209B2Lithography method to reduce spacing between interconnect wires in interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →