Inventor · disambiguated record
Yi Sun
Also filed as: SUN YI · SUN YI CHIANG
1 granted patent·2 pending applications·30 citations·filing 2017–2024
45Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0193US9899305B1Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 20, 2018·30 cites·20 claims
- 0269US2024266278A1Interconnection structure for integrated circuit packageMONOLITHIC POWER SYSTEMS INC·Filed 2024·Application pending·0 cites
- 0358US2022399264A1Interconnection structure for integrated circuit package and the method thereofMONOLITHIC POWER SYSTEMS INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →