Inventor · disambiguated record
Yiqi Tang
Also filed as: TANG YIQI
43 granted patents·29 pending applications·28 citations·filing 2016–2025
96Inventor score
Files withTEXAS INSTRUMENTS INC72
Top patents by PatentIndex Score
72 records- 0194US11600932B2Antenna-on-package including multiple types of antennaTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 7, 2023·3 cites·20 claims
- 0294US10475786B1Packaged semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 12, 2019·12 cites·18 claims
- 0393US12218036B2Package substrate having integrated passive device(s) between leadsTEXAS INSTRUMENTS INC·Filed 2023·Granted Feb 4, 2025·2 cites·20 claims
- 0492US11837775B2Microelectronic device package including antenna and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 5, 2023·2 cites·23 claims
- 0592US11784114B2Plated metal layer in power packagesTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 0690US11978699B2Electronic device multilevel package substrate for improved electromigration preformanceTEXAS INSTRUMENTS INC·Filed 2021·Granted May 7, 2024·2 cites·20 claims
- 0789US11784113B2Multilayer package substrate with stress bufferTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 0883US11621232B2Semiconductor package with electromagnetic interference shieldingTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 4, 2023·1 cites·21 claims
- 0980US2025260154A1Antenna-on-package systemTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1078US12406915B2Plated metal layer in power packagesTEXAS INSTRUMENTS INC·Filed 2023·Granted Sep 2, 2025·0 cites·23 claims
- 1177US10892405B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 12, 2021·2 cites·21 claims
- 1276US12494450B2Multi-layer semiconductor package with stacked passive componentsTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 9, 2025·0 cites·9 claims
- 1376US2025140708A1Semiconductor package with shunt and patterned metal traceTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1473US12438072B2Multilayer package substrate with stress bufferTEXAS INSTRUMENTS INC·Filed 2023·Granted Oct 7, 2025·0 cites·24 claims
- 1573US12165989B2Semiconductor package with electromagnetic interference shieldingTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 10, 2024·0 cites·23 claims
- 1672US12400945B2Electronic device multilevel package substrate for improved electromigration performanceTEXAS INSTRUMENTS INC·Filed 2024·Granted Aug 26, 2025·0 cites·18 claims
- 1772US12113293B2Antenna-on-package including multiple types of antennaTEXAS INSTRUMENTS INC·Filed 2023·Granted Oct 8, 2024·0 cites·25 claims
- 1872US11881460B2Ceramic semiconductor package seal ringsTEXAS INSTRUMENTS INC·Filed 2023·Granted Jan 23, 2024·0 cites·22 claims
- 1970US12489070B2Electronic device and multilevel package substrate with integrated filterTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 2, 2025·0 cites·14 claims
- 2070US12224480B2Microelectronic device package including antenna horn and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 2170US11901271B2High current packages with reduced solder layer countTEXAS INSTRUMENTS INC·Filed 2022·Granted Feb 13, 2024·0 cites·27 claims
- 2270US11557722B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 2369US12315987B2Antenna-on-package systemTEXAS INSTRUMENTS INC·Filed 2022·Granted May 27, 2025·0 cites·16 claims
- 2468US12489061B2Semiconductor device with multiple diesTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 2, 2025·0 cites·14 claims
- 2568US12418097B2Microelectronic device package including antenna and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 2667US11978709B2Integrated system-in-package with radiation shieldingTEXAS INSTRUMENTS INC·Filed 2022·Granted May 7, 2024·0 cites·23 claims
- 2767US2025233301A1Antenna in package having antenna on package substrateTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 2867US2025299972A1Multilayer package substrate with improved current density distributionTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 2966US12243849B2Passives to facilitate mold compound flowTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 4, 2025·0 cites·18 claims
- 3066US11587891B2Ceramic semiconductor package seal ringsTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 21, 2023·0 cites·14 claims
- 3166US11587899B2Multi-layer semiconductor package with stacked passive componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 21, 2023·0 cites·24 claims
- 3266US2025183516A1Microelectronic Device Package Including Antenna Horn and Semiconductor DeviceTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 3366US2025201774A1Passives to facilitate mold compound flowTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 3465US12444702B2Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrateTEXAS INSTRUMENTS INC·Filed 2022·Granted Oct 14, 2025·0 cites·16 claims
- 3564US12327736B2Multilayer package substrate with improved current density distributionTEXAS INSTRUMENTS INC·Filed 2022·Granted Jun 10, 2025·0 cites·13 claims
- 3664US12322856B2Antenna in package having antenna on package substrateTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 3, 2025·0 cites·11 claims
- 3764US12211800B2Semiconductor package with shunt and patterned metal traceTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 28, 2025·0 cites·16 claims
- 3863US11545420B2High current packages with reduced solder layer countTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 3, 2023·0 cites·23 claims
- 3962US11600555B2Package substrate having integrated passive device(s) between leadsTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 7, 2023·0 cites·10 claims
- 4062US11362047B2Integrated system-in-package with radiation shieldingTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 4160US12374608B2Hybrid chip carrier packageTEXAS INSTRUMENTS INC·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 4259US11955479B2Packaged semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2019·Granted Apr 9, 2024·0 cites·43 claims
- 4357US12040265B2High-frequency ceramic packages with modified castellation and metal layer architecturesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 16, 2024·0 cites·15 claims
- 4454US12512406B2Back end of line structure for improved current density in HR devicesTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 30, 2025·0 cites·13 claims
- 4554US12381139B2Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic deviceTEXAS INSTRUMENTS INC·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 4654US12266596B2Semiconductor device with a power converter module connected to connection assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 1, 2025·0 cites·23 claims
- 4754US12243911B2Integrated circuit package for isolation diesTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 4, 2025·0 cites·6 claims
- 4853US2024113050A1Semiconductor packages with directional antennasTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4953US2024178154A1Electronic device package emi shielding with grounded mold interconnectTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 5053US2024178155A1Multilevel package substrate with box shieldTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →