Inventor · disambiguated record
Ying-Hsiu Tsai
Also filed as: TSAI YING-HSIU
3 granted patents·2 pending applications·24 citations·filing 2004–2017
65Inventor score
Top patents by PatentIndex Score
5 records- 0188US8021992B2High aspect ratio gap fill application using high density plasma chemical vapor depositionTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 20, 2011·21 cites·18 claims
- 0281US10272540B2System and method for polishing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 0369US9669514B2System and method for polishing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·18 claims
- 0440US2007026653A1Cap layer on doped dielectricTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 0537US2006017166A1Robust fluorine containing Silica Glass (FSG) Film with less free fluorineLEU PO-HSIUNG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →