Inventor · disambiguated record
Yi-Chi Tsai
Also filed as: TSAI YI-CHI
0 granted patents·3 pending applications·0 citations·filing 2023–2025
Files withWINBOND ELECTRONICS CORP3
Top patents by PatentIndex Score
3 records- 0168US2025324571A1Semiconductor device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0262US2025393197A1Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0351US2024371790A1Semiconductor device and method forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →