Inventor · disambiguated record
Yi-Da Tsai
Also filed as: TSAI YI-DA
20 granted patents·4 pending applications·45 citations·filing 2012–2024
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD18DELTA ELECTRONICS INC3CHEN MENG-TSE1TAIWAN SEMICONDUCTOR MFG1TSAI TSAI-TSUNG1
Top patents by PatentIndex Score
24 records- 0197US10014260B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·14 cites·20 claims
- 0294US10867932B2Method for manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·3 cites·20 claims
- 0387US10535609B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·3 cites·20 claims
- 0485US11532564B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·1 cites·20 claims
- 0584US2025132268A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0682US12512419B2Method of fabricating memory device and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0782US12218082B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0882US11075131B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·3 cites·20 claims
- 0981US12021037B2Method for manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1075US2024404954A1Method of forming packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1173US11855006B2Memory device, package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·17 claims
- 1273US8889486B2Methods and apparatus for package on package structuresCHEN MENG-TSE·Filed 2012·Granted Nov 18, 2014·3 cites·20 claims
- 1372USD804031SImaging scannerDELTA ELECTRONICS INC·Filed 2016·Granted Nov 28, 2017·16 cites·1 claims
- 1471US11640954B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 1570US10797025B2Advanced INFO POP and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 6, 2020·1 cites·20 claims
- 1670US10373931B2Semiconductor package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 6, 2019·1 cites·18 claims
- 1767US12512451B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1864US11955460B2Advanced info POP and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 9, 2024·0 cites·20 claims
- 1962US10971475B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 2053US9312243B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 12, 2016·0 cites·20 claims
- 2151US10874368B2Scanning imaging device and animal carrying bed thereofDELTA ELECTRONICS INC·Filed 2018·Granted Dec 29, 2020·0 cites·16 claims
- 2251US2020020634A1Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites
- 2350US11517276B2Scanning imaging device, carrier and carrier positioning deviceDELTA ELECTRONICS INC·Filed 2017·Granted Dec 6, 2022·0 cites·20 claims
- 2446US2014042622A1Fine Pitch Package-on-Package StructureTSAI TSAI-TSUNG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →