Inventor · disambiguated record
Yi-Lin Tsai
Also filed as: TSAI YI-LIN
34 granted patents·12 pending applications·734 citations·filing 2006–2025
96Inventor score
Files withMEDIATEK INC12IBM7SILICONWARE PRECISION INDUSTRIES CO LTD4RADIANT OPTO ELECTRONICS CORP3CHEN CHIH-HAO2
Top patents by PatentIndex Score
46 records- 0197US9461018B1Fan-out PoP structure with inconsecutive polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·671 cites·20 claims
- 0296US12136597B2Semiconductor package having an interposer in which one or more dies are formed and method of forming the sameMEDIATEK INC·Filed 2021·Granted Nov 5, 2024·4 cites·31 claims
- 0395US11854930B2Semiconductor chip package and fabrication method thereofMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·2 cites·18 claims
- 0493US10083913B2Fan-out POP structure with inconsecutive polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 25, 2018·10 cites·20 claims
- 0592US11372283B1Backlight module and display deviceRADIANT OPTO ELECTRONICS CORP·Filed 2021·Granted Jun 28, 2022·4 cites·19 claims
- 0691US11469152B2Semiconductor chip package and fabrication method thereofMEDIATEK INC·Filed 2020·Granted Oct 11, 2022·2 cites·18 claims
- 0788US9337063B2Package for three dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·8 cites·18 claims
- 0887US12154848B2Electronic package and manufacturing method thereof, and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 26, 2024·2 cites·8 claims
- 0982US8995766B1Image processing method and image processing deviceHIMAX IMAGING LTD·Filed 2013·Granted Mar 31, 2015·5 cites·13 claims
- 1081US7654722B2Light guide plateRADIANT OPTO ELECTRONICS CORP·Filed 2007·Granted Feb 2, 2010·11 cites·5 claims
- 1179US10169398B2Identifying corrupted text segmentsIBM·Filed 2018·Granted Jan 1, 2019·2 cites·1 claims
- 1274US8772929B2Package for three dimensional integrated circuitCHEN CHIH-HAO·Filed 2011·Granted Jul 8, 2014·3 cites·14 claims
- 1374US7461198B2System and method for configuration and management of flash memoryGENESYS LOGIC INC·Filed 2006·Granted Dec 2, 2008·6 cites·7 claims
- 1473US10318650B2Identifying corrupted text segmentsIBM·Filed 2018·Granted Jun 11, 2019·1 cites·1 claims
- 1568US11487155B2Backlight module and display deviceRADIANT OPTO ELECTRONICS CORP·Filed 2022·Granted Nov 1, 2022·0 cites·20 claims
- 1668US2025038097A1Electronic package and manufacturing method thereof, and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1766US9662812B2Methods for molding integrated circuitsCHEN CHIH-HAO·Filed 2012·Granted May 30, 2017·2 cites·20 claims
- 1862US11881142B1Image brightness adjusting method and image brightness adjusting deviceREALTEK SEMICONDUCTOR CORP·Filed 2023·Granted Jan 23, 2024·0 cites·19 claims
- 1961US12444715B2Semiconductor package structureMEDIATEK INC·Filed 2023·Granted Oct 14, 2025·0 cites·14 claims
- 2061US12278173B2Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 2161US2024297120A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2260US2024193444A1Hierarchical artificial intelligence computing system and implementation method thereofDELTA ELECTRONICS INC·Filed 2023·Application pending·0 cites
- 2358US11670596B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 2458US2024038614A1Semiconductor package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 2557US10229677B2Smart launching mobile applications with preferred user interface (UI) languagesIBM·Filed 2016·Granted Mar 12, 2019·1 cites·20 claims
- 2657US10025812B2Identifying corrupted text segmentsIBM·Filed 2017·Granted Jul 17, 2018·0 cites·1 claims
- 2757US2023387075A1Semiconductor packageMEDIATEK INC·Filed 2023·Application pending·0 cites
- 2857US2025201695A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 2955US11830851B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Nov 28, 2023·0 cites·14 claims
- 3054US10402392B2Identifying corrupted text segmentsIBM·Filed 2016·Granted Sep 3, 2019·0 cites·12 claims
- 3154US2023060065A1Lidded semiconductor packageMEDIATEK INC·Filed 2022·Application pending·0 cites
- 3253US12140863B2Imprint methodUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 3352US12021031B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Jun 25, 2024·0 cites·17 claims
- 3452US7861028B2System and method for configuration and management of flash memoryGENESYS LOGIC INC·Filed 2008·Granted Dec 28, 2010·0 cites·5 claims
- 3548US11087218B2Electronic device, presentation method for decision-making process module and computer readable mediumIND TECH RES INST·Filed 2017·Granted Aug 10, 2021·0 cites·21 claims
- 3646US9077941B2Image processing method and image processing deviceHIMAX IMAGING LTD·Filed 2013·Granted Jul 7, 2015·0 cites·14 claims
- 3745US2021217707A1Semiconductor package having re-distribution layer structure on substrate componentMEDIATEK INC·Filed 2020·Application pending·0 cites
- 3843US8629043B2Methods for de-bonding carriersWANG CHUNG YU·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
- 3942US2009168775A1Heuristic algorithm for application-layer multicast with minimum delayNAT TSING HUA UNIVERSITY OF TA·Filed 2008·Application pending·0 cites
- 4041US10757051B2Integrating different messaging applications without relying on messaging protocolsIBM·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
- 4141US9833195B2Biomedical signal sensing circuitUNIV NAT TAIWAN·Filed 2014·Granted Dec 5, 2017·0 cites·10 claims
- 4239US8811541B2Receiver, signal demodulation module and demodulation method thereofUNIV NAT TAIWAN·Filed 2013·Granted Aug 19, 2014·0 cites·19 claims
- 4338US2013077858A1Image processing module and image processing methodPENG YUAN-CHIH·Filed 2011·Application pending·0 cites
- 4437US11499244B2Device for impregnation using electrophoresisMARKETECH INT CORP·Filed 2020·Granted Nov 15, 2022·0 cites·12 claims
- 4535US2017329767A1Localization of application user interfaceIBM·Filed 2016·Application pending·0 cites
- 4634US2012280843A1Broadband delta-sigma adc modulator loop with delay compensationTSAI YI-LIN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →