Inventor · disambiguated record
Ying-Cheng Tseng
Also filed as: TSENG YING-CHENG
31 granted patents·6 pending applications·58 citations·filing 2017–2025
95Inventor score
Top patents by PatentIndex Score
37 records- 0198US12113022B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 8, 2024·6 cites·20 claims
- 0295US11004786B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·10 cites·20 claims
- 0395US10832985B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·12 cites·20 claims
- 0494US11929318B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0594US10074615B1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·10 cites·20 claims
- 0693US11374136B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0790US12051666B2Package structure and manufacturing method of package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 30, 2024·1 cites·20 claims
- 0890US11742254B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 29, 2023·2 cites·20 claims
- 0989US11355466B2Package structure and manufacturing method of package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
- 1089US10840227B2Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·5 cites·20 claims
- 1186US12362274B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1286US10762319B2Fingerprint sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·3 cites·20 claims
- 1385US2025273565A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1483US12334434B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1579US2024371776A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1678US2024339427A1Manufacturing method of package structure and package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1776US11847852B2Manufacturing method of fingerprint sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1876US2024088307A1Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1974US11855232B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·13 claims
- 2073US2023207472A1Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2171US10861841B2Semiconductor device with multiple polarity groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·1 cites·20 claims
- 2270US12015017B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 2369US11580767B2Fingerprint sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 2466US10396419B2Common-mode signal absorberUNIV NAT TAIWAN·Filed 2019·Granted Aug 27, 2019·1 cites·8 claims
- 2565US11527525B2Semiconductor device with multiple polarity groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 2664US12205860B2Sensor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 2763US11049850B2Methods of bonding the strip-shaped under bump metallization structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 29, 2021·0 cites·20 claims
- 2862US11631658B2Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·20 claims
- 2958US10658348B2Semiconductor devices having a plurality of first and second conductive stripsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 3057US11842993B2Semiconductor device with multiple polarity groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 3157US11011501B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 18, 2021·0 cites·20 claims
- 3257US2023253384A1Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3350US10211496B2Common-mode signal absorber and equivalent circuit thereofUNIV NAT TAIWAN·Filed 2017·Granted Feb 19, 2019·0 cites·8 claims
- 3445US11164819B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
- 3545US10566945B2Noise suppression device and equivalent circuit thereofUNIV NAT TAIWAN·Filed 2017·Granted Feb 18, 2020·0 cites·22 claims
- 3643US11509278B2Common-mode noise filterEMPASS TECH INC·Filed 2021·Granted Nov 22, 2022·0 cites·18 claims
- 3739US11158555B2Package structure having sensor die with touch sensing electrode, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 26, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →