Inventor · disambiguated record

Yi-Lei Tseng

Also filed as: TSENG YI-LEI

1 granted patent·0 citations·filing 2021–2021

10Inventor score

Technology areasH10B

Files withFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD1

Top patents by PatentIndex Score

1 record

0152US12075609B2Contact structure, contact pad layout and structure, mask combination and manufacturing method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·6 claims

Join the waitlist — get patent alerts

Get an alert when Yi-Lei Tseng files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →