Inventor · disambiguated record
Yi-Hsiu Tseng
Also filed as: TSENG YI-HSIU
4 granted patents·2 pending applications·29 citations·filing 2001–2020
74Inventor score
Files withADVANCED SEMICONDUCTOR ENG3ADVANCED SEMICONDUCTOR INC1HON HAI PREC IND CO LTD1IND TECH RES INST1
Top patents by PatentIndex Score
6 records- 0190US9496238B2Sloped bonding structure for semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Nov 15, 2016·10 cites·19 claims
- 0284US9984993B2Bonding structure for semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR INC·Filed 2016·Granted May 29, 2018·8 cites·18 claims
- 0359US8375200B2Embedded device and file change notification method of the embedded deviceHON HAI PREC IND CO LTD·Filed 2010·Granted Feb 12, 2013·1 cites·18 claims
- 0457US6653235B2Fabricating process for forming multi-layered metal bumps by electroless platingIND TECH RES INST·Filed 2001·Granted Nov 25, 2003·10 cites·17 claims
- 0556US2020335431A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 0646US2018076118A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →