Inventor · disambiguated record
Ying-Fu Tung
Also filed as: TUNG YING-FU
9 granted patents·2 citations·filing 2019–2024
76Inventor score
Files withWINBOND ELECTRONICS CORP9
Top patents by PatentIndex Score
9 records- 0186US11575051B2Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Feb 7, 2023·2 cites·8 claims
- 0277US12432998B2Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Granted Sep 30, 2025·0 cites·9 claims
- 0367US11908953B2Manufacturing method of memory deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Feb 20, 2024·0 cites·14 claims
- 0465US12015059B2Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Jun 18, 2024·0 cites·13 claims
- 0562US11538818B2Manufacturing method for memory structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Dec 27, 2022·0 cites·15 claims
- 0662US11121142B2Memory structure and manufacturing method thereforWINBOND ELECTRONICS CORP·Filed 2019·Granted Sep 14, 2021·0 cites·9 claims
- 0746US11972972B2Isolation structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 30, 2024·0 cites·9 claims
- 0846US11101177B1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
- 0941US11637241B2Resistive random access memory and manufacturing method thereoffWINBOND ELECTRONICS CORP·Filed 2020·Granted Apr 25, 2023·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →