Inventor · disambiguated record

Yi Dao Wang

Also filed as: WANG YI DAO

5 granted patents·2 pending applications·4 citations·filing 2021–2025

68Inventor score

Technology areasH10W

Files withADVANCED SEMICONDUCTOR ENG7

Top patents by PatentIndex Score

7 records

0186US11817421B2Method for manufacturing semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 14, 2023·2 cites·19 claims
0286US11652081B2Method for manufacturing semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted May 16, 2023·2 cites·19 claims
0381US12218094B2Electronic package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Feb 4, 2025·0 cites·20 claims
0469US12500205B2Method for manufacturing semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 16, 2025·0 cites·6 claims
0569US2025157972A1Electronic package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
0668US11935855B2Electronic package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Mar 19, 2024·0 cites·10 claims
0753US2025069901A1Method for manufacturing package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →