Inventor · disambiguated record
Yi-Lun Wu
Also filed as: WU YI-LUN
1 granted patent·2 pending applications·4 citations·filing 2006–2017
23Inventor score
Top patents by PatentIndex Score
3 records- 0161US10014283B1High heat dissipation stacked chip package structure and the manufacture method thereofJING QIAO CORPORATION LTD·Filed 2017·Granted Jul 3, 2018·4 cites·10 claims
- 0238US2007149027A1Signal connector resistant to plug/unplug forceAVERMEDIA TECH INC·Filed 2006·Application pending·0 cites
- 0330US2008176439A1Signal connector with miniaturized pcb-coupling meansAVERMEDIA TECH INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →