Inventor · disambiguated record
Ying-Cheng Wu
Also filed as: WU YING · WU YING-CHENG
34 granted patents·14 pending applications·158 citations·filing 2005–2024
96Inventor score
Files withALTUS TECHNOLOGY INC17HON HAI PREC IND CO LTD17REALTEK SEMICONDUCTOR CORP6HUAWEI TECH CO LTD4WU YING-CHENG2
Top patents by PatentIndex Score
48 records- 0190US7729606B2Lens module and digital camera module using sameHON HAI PREC IND CO LTD·Filed 2007·Granted Jun 1, 2010·14 cites·13 claims
- 0290US7408205B2Digital camera moduleALTUS TECHNOLOGY INC·Filed 2006·Granted Aug 5, 2008·22 cites·14 claims
- 0387US9989928B2Time-to-digital converterHUAWEI TECH CO LTD·Filed 2017·Granted Jun 5, 2018·8 cites·16 claims
- 0486US7643081B2Digital camera module with small sized image sensor chip packageALTUS TECHNOLOGY INC·Filed 2006·Granted Jan 5, 2010·11 cites·3 claims
- 0582US7460317B2Digital camera module with improved image qualityALTUS TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·12 cites·9 claims
- 0681US7521770B2Image capturing deviceHON HAI PREC IND CO LTD·Filed 2007·Granted Apr 21, 2009·10 cites·20 claims
- 0778US8760559B2Miniaturization image capturing module and method of manufacturing the sameLIU TI-LUN·Filed 2011·Granted Jun 24, 2014·4 cites·12 claims
- 0876US10630308B2Analog-to-digital converter with low inter-symbol interference and reduced common-mode voltage mismatchREALTEK SEMICONDUCTOR CORP·Filed 2019·Granted Apr 21, 2020·3 cites·10 claims
- 0976US10367517B2Analog to digital conversion apparatus and analog to digital converter calibration method of the sameREALTEK SEMICONDUCTOR CORP·Filed 2018·Granted Jul 30, 2019·3 cites·16 claims
- 1075US10312925B1Multiplying DAC of pipelined ADCREALTEK SEMICONDUCTOR CORP·Filed 2018·Granted Jun 4, 2019·3 cites·15 claims
- 1174US8085547B2Electronic elements carrierWU YING-CHENG·Filed 2007·Granted Dec 27, 2011·9 cites·9 claims
- 1274US7365421B2IC chip package with isolated viasALTUS TECHNOLOGY INC·Filed 2005·Granted Apr 29, 2008·7 cites·10 claims
- 1372US7696465B2Image sensor package, camera module having same and manufacturing method for the sameHON HAI PREC IND CO LTD·Filed 2008·Granted Apr 13, 2010·6 cites·16 claims
- 1472US7638864B2Chip package, method of making same and digital camera module using the packageHON HAI PREC IND CO LTD·Filed 2007·Granted Dec 29, 2009·5 cites·16 claims
- 1571US7646429B2Digital camera module packaging methodALTUS TECHNOLOGY INC·Filed 2006·Granted Jan 12, 2010·3 cites·16 claims
- 1671US7554184B2Image sensor chip packageALTUS TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·5 cites·19 claims
- 1770US7595839B2Image sensor chip packaging methodALTUS TECHNOLOGY INC·Filed 2006·Granted Sep 29, 2009·5 cites·19 claims
- 1869US7929033B2Image sensor package and camera module having sameHON HAI PREC IND CO LTD·Filed 2008·Granted Apr 19, 2011·5 cites·17 claims
- 1968US7342215B2Digital camera module package fabrication methodALTUS TECHNOLOGY INC·Filed 2006·Granted Mar 11, 2008·4 cites·19 claims
- 2067US7540672B2Digital still camera moduleALTUS TECHNOLOGY INC·Filed 2005·Granted Jun 2, 2009·4 cites·19 claims
- 2165US12506487B2Compensation circuit and compensation method for successive-approximation register (SAR) analog-to-digital converter (ADC)REALTEK SEMICONDUCTOR CORP·Filed 2024·Granted Dec 23, 2025·0 cites·18 claims
- 2262US7796188B2Compact image sensor package and method of manufacturing the sameHON HAI PREC IND CO LTD·Filed 2007·Granted Sep 14, 2010·2 cites·22 claims
- 2362US7696619B2Stack combination of plural chip package unitsHON HAI PREC IND CO LTD·Filed 2008·Granted Apr 13, 2010·3 cites·6 claims
- 2461US7916212B2Image sensor package and camera module utilizing the sameHON HAI PREC IND CO LTD·Filed 2008·Granted Mar 29, 2011·4 cites·17 claims
- 2561US7821565B2Imaging module packageHON HAI PREC IND CO LTD·Filed 2008·Granted Oct 26, 2010·2 cites·10 claims
- 2661US7626160B2Image sensing module with improved assembly precisionALTUS TECHNOLOGY INC·Filed 2006·Granted Dec 1, 2009·2 cites·6 claims
- 2760US7417327B2IC chip package with coverALTUS TECHNOLOGY INC·Filed 2005·Granted Aug 26, 2008·2 cites·18 claims
- 2856US12341518B2LatchREALTEK SEMICONDUCTOR CORP·Filed 2023·Granted Jun 24, 2025·0 cites·7 claims
- 2956US10303124B2Time-to-digital converterHUAWEI TECH CO LTD·Filed 2018·Granted May 28, 2019·0 cites·20 claims
- 3048US11418206B2Flash analog to digital converter and calibration methodREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Aug 16, 2022·0 cites·17 claims
- 3148US2008252771A1Camera module with compact packaging of image sensor chip and method of manufacturing the sameHON HAI PREC IND CO LTD·Filed 2007·Application pending·0 cites
- 3248US2013026589A1Miniaturization active sensing module and method of manufacturing the sameLITE ON TECHNOLOGY CORP·Filed 2011·Application pending·0 cites
- 3347US2009166833A1Semiconductor unit which includes multiple chip packages integrated togetherHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 3446US2008203512A1Image sensor chip packageHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 3545US7538862B2Testing system for digital camera modulesALTUS TECHNOLOGY INC·Filed 2006·Granted May 26, 2009·0 cites·13 claims
- 3644US2008251875A1Semiconductor packageHON HAI PREC IND CO LTD·Filed 2007·Application pending·0 cites
- 3744US2024259022A1Logic gate circuit, latch, and flip-flopHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 3843US7592197B2Image sensor chip package fabrication methodALTUS TECHNOLOGY INC·Filed 2006·Granted Sep 22, 2009·0 cites·14 claims
- 3943US2009135297A1Camera moduleHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 4042US10101709B2Time registerHUAWEI TECH CO LTD·Filed 2017·Granted Oct 16, 2018·0 cites·14 claims
- 4142US2009267206A1Stacked semiconductor packageHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 4242US2007034772A1Image sensor chip packageALTUS TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 4342US2009135296A1Imaging module packageHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 4442US2007108561A1Image sensor chip packageALTUS TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 4541US2009153706A1Imaging module packageHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 4640US2006273249A1Image sensor chip package and method of manufacturing the sameALTUS TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 4738US2007152345A1Stacked chip packaging structureALTUS TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 4836US8072489B2Digital camera module using stacked chip packageWU YING-CHENG·Filed 2006·Granted Dec 6, 2011·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →