Inventor · disambiguated record
Yi Xia
Also filed as: XIA YI · XIA YI-SHEN
12 granted patents·4 pending applications·18 citations·filing 2003–2023
84Inventor score
Files withINTEL CORP9THE WELLBOSS COMPANY LLC4UNIV KUNMING SCIENCE & TECHNOLOGY2DESTINY TECHNOLOGY CORP1
Top patents by PatentIndex Score
16 records- 0185US11078739B2Downhole tool with bottom composite slipTHE WELLBOSS COMPANY LLC·Filed 2018·Granted Aug 3, 2021·4 cites·18 claims
- 0261US11634958B2Downhole tool with bottom composite slipTHE WELLBOSS COMPANY LLC·Filed 2021·Granted Apr 25, 2023·0 cites·19 claims
- 0361US7126644B2Rapid white balance method for color digital imagesDESTINY TECHNOLOGY CORP·Filed 2003·Granted Oct 24, 2006·7 cites·19 claims
- 0458US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 0558US11917790B2Thermal control for processor-based devicesINTEL CORP·Filed 2020·Granted Feb 27, 2024·0 cites·22 claims
- 0656US12169180B2Optical leak detection of liquid cooling components within an electronic systemINTEL CORP·Filed 2020·Granted Dec 17, 2024·0 cites·20 claims
- 0750US12424513B2Technologies for isolated heat dissipating devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·19 claims
- 0850US12213288B2Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chipsINTEL CORP·Filed 2020·Granted Jan 28, 2025·0 cites·21 claims
- 0950US2023422389A1Cold plates for secondary side components of printed circuit boardsINTEL CORP·Filed 2023·Application pending·0 cites
- 1048USD877216SOne-piece slipTHE WELLBOSS COMPANY LLC·Filed 2018·Granted Mar 3, 2020·4 cites·1 claims
- 1147US2024244800A1Hybrid cooler to thermally cool semiconductor devices inside and outside a chip packageINTEL CORP·Filed 2021·Application pending·0 cites
- 1246US11571676B2Opening-closing type microwave catalytic reaction apparatusUNIV KUNMING SCIENCE & TECHNOLOGY·Filed 2021·Granted Feb 7, 2023·0 cites·7 claims
- 1344USD877217SOne-piece slipTHE WELLBOSS COMPANY LLC·Filed 2018·Granted Mar 3, 2020·3 cites·1 claims
- 1442US2022117112A1Enhanced electronic package thermal dissipation with in-situ transpiration cooling and reduced thermal interstitial resistanceINTEL CORP·Filed 2020·Application pending·0 cites
- 1540US11445580B2Microwave-based high-throughput material processing device with concentric rotary chassisUNIV KUNMING SCIENCE & TECHNOLOGY·Filed 2020·Granted Sep 13, 2022·0 cites·10 claims
- 1640US2022225542A1Thin form factor assemblies for cooling dimmsINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →