Inventor · disambiguated record
Yi Xu
Also filed as: XU YI · XU YI ELYN
26 granted patents·2 pending applications·15 citations·filing 2015–2024
92Inventor score
Top patents by PatentIndex Score
28 records- 0184US10153221B1Face down dual sided chip scale memory packageMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 11, 2018·5 cites·28 claims
- 0279US10332899B23D package having edge-aligned die stack with direct inter-die wire connectionsINTEL CORP·Filed 2017·Granted Jun 25, 2019·3 cites·11 claims
- 0374US11901264B2Choked flow coolingSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2018·Granted Feb 13, 2024·2 cites·25 claims
- 0474US10879152B2Through mold via (TMV) using stacked modular mold ringsINTEL CORP·Filed 2016·Granted Dec 29, 2020·2 cites·18 claims
- 0573US12266591B2Choked flow coolingSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2024·Granted Apr 1, 2025·0 cites·16 claims
- 0670US11545464B2Diode for use in testing semiconductor packagesINTEL CORP·Filed 2018·Granted Jan 3, 2023·1 cites·18 claims
- 0770US10597698B2Chromatin immunocapture devices and methods of useUNIV ILLINOIS·Filed 2015·Granted Mar 24, 2020·1 cites·13 claims
- 0868US10213782B2Microfluidic devicesUNIV ILLINOIS·Filed 2016·Granted Feb 26, 2019·1 cites·19 claims
- 0966US11710674B2Embedded component and methods of making the sameINTEL CORP·Filed 2022·Granted Jul 25, 2023·0 cites·12 claims
- 1058US11566275B2Chromatin immunocapture devices and methods of useUNIV ILLINOIS·Filed 2020·Granted Jan 31, 2023·0 cites·19 claims
- 1157US10573575B2Semiconductor package with thermal finsINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·24 claims
- 1252US10366934B2Face down dual sided chip scale memory packageMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 30, 2019·0 cites·15 claims
- 1351US12237300B2Through-substrate void filling for an integrated circuit assemblyINTEL CORP·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 1451US11658079B2Temporary interconnect for use in testing a semiconductor packageINTEL CORP·Filed 2019·Granted May 23, 2023·0 cites·25 claims
- 1551US11569144B2Semiconductor package design for solder joint reliabilityINTEL CORP·Filed 2018·Granted Jan 31, 2023·0 cites·13 claims
- 1651US11476174B2Solder mask design for delamination preventionINTEL CORP·Filed 2018·Granted Oct 18, 2022·0 cites·25 claims
- 1750US11848292B2Pad design for thermal fatigue resistance and interconnect joint reliabilityINTEL CORP·Filed 2018·Granted Dec 19, 2023·0 cites·25 claims
- 1850US11652031B2Shrinkable package assemblyINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·17 claims
- 1948US11694976B2Bowl shaped padINTEL CORP·Filed 2018·Granted Jul 4, 2023·0 cites·16 claims
- 2047US11315843B2Embedded component and methods of making the sameINTEL CORP·Filed 2016·Granted Apr 26, 2022·0 cites·16 claims
- 2146US12347784B2Interposer with step featureINTEL CORP·Filed 2019·Granted Jul 1, 2025·0 cites·14 claims
- 2246US11894334B2Dual head capillary design for vertical wire bondINTEL CORP·Filed 2018·Granted Feb 6, 2024·0 cites·10 claims
- 2346US11749653B2Multi-die, vertical-wire package-in-package apparatus, and methods of making sameINTEL CORP·Filed 2017·Granted Sep 5, 2023·0 cites·12 claims
- 2445US11948917B2Die over mold stacked semiconductor packageINTEL CORP·Filed 2019·Granted Apr 2, 2024·0 cites·21 claims
- 2542US2020118991A1Pre-patterned fine-pitch bond pad interposerINTEL CORP·Filed 2018·Application pending·0 cites
- 2641US11211314B2Interposer for electrically connecting stacked integrated circuit device packagesINTEL CORP·Filed 2017·Granted Dec 28, 2021·0 cites·25 claims
- 2737US11056465B2Semiconductor package having singular wire bond on bonding padsINTEL CORP·Filed 2016·Granted Jul 6, 2021·0 cites·20 claims
- 2835US2020118940A1Die with bumper for solder joint reliabilityINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →