Inventor · disambiguated record

Yifei Yan

Also filed as: YAN YIFEI

20 granted patents·6 pending applications·5 citations·filing 2016–2024

89Inventor score

Technology areasH10W H10B H10P C04B A61B

Files withFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD22 NANO & ADVANCED MATERIALS INST LTD2 TENCENT TECH SHENZHEN CO LTD1 UNIV ILLINOIS1

Top patents by PatentIndex Score

26 records

0185US11903181B2Semiconductor structure and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Feb 13, 2024·1 cites·14 claims
0284US12419039B2Semiconductor memory deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·16 claims
0384US12245420B2Method for forming semiconductor memory deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Granted Mar 4, 2025·0 cites·11 claims
0484US10207954B2Synthetic aggregate from waste materialsNANO & ADVANCED MATERIALS INST LTD·Filed 2016·Granted Feb 19, 2019·3 cites·19 claims
0580US12396152B2Semiconductor structure and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
0674US12256533B2Semiconductor memory device and method of fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Granted Mar 18, 2025·0 cites·20 claims
0774US10450230B2Fire resistant eco concrete blocks containing waste glassNANO & ADVANCED MATERIALS INST LTD·Filed 2017·Granted Oct 22, 2019·1 cites·11 claims
0873US12004340B2Semiconductor memory device and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
0972US12381082B2Semiconductor structure, method for fabricating thereof, and method for fabricating semiconductor layoutFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·10 claims
1072US12191299B2Method of fabricating semiconductor deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·10 claims
1170US12494231B2Semiconductor device and method of fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·7 claims
1270US12444455B2Memory structureFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·17 claims
1369US12309993B2Pattern layout and the forming method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted May 20, 2025·0 cites·8 claims
1469US11996290B2Semiconductor structure, method for fabricating thereof, and method for fabricating semiconductor layoutFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted May 28, 2024·0 cites·10 claims
1569US11887977B2Semiconductor device and method of fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·9 claims
1668US11930631B2Semiconductor memory device and method of fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·18 claims
1764US11688433B2Semiconductor device and method of fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·8 claims
1860US11825641B2Pattern layout and the forming method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·8 claims
1960US2025201709A1Semiconductor device and method of manufacturing the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
2057US2025004726A1Resource configuration method and apparatus based on parasitic program, device, medium, and productTENCENT TECH SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
2157US2024306373A1Semiconductor device and method of fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
2257US2025038142A1Semiconductor device and method of forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
2355US2024405086A1Semiconductor device and method of fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
2451US2024274531A1Semiconductor structure, method for fabricating thereof, and method for fabricating semiconductor layoutFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
2545US12016687B2Implantable probes and methods of fabricationUNIV ILLINOIS·Filed 2021·Granted Jun 25, 2024·0 cites·22 claims
2642US12147156B2Method of fabricating a semiconductor layout and a semiconductor structureFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·15 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →