Inventor · disambiguated record
Yi Yang
Also filed as: YANG YI · YANG YI-BIN
9 granted patents·29 pending applications·10 citations·filing 2014–2024
78Inventor score
Files withINTEL CORP31BEIJING BOE OPTOELECTRONICS TECH CO LTD2CORETRONIC INTELLIGENT CLOUD SERVICE CORP1NINGBO SUNNY OPOTECH CO LTD1OPTOMA CORP1
Top patents by PatentIndex Score
38 records- 0183US9607352B2Prediction based primitive sorting for tile based renderingINTEL CORP·Filed 2014·Granted Mar 28, 2017·7 cites·22 claims
- 0277US11869171B2Adaptive deformable kernel prediction network for image de-noisingINTEL CORP·Filed 2020·Granted Jan 9, 2024·1 cites·11 claims
- 0377US10885831B2Display method and display system of singular-shaped display panel, storage device and display deviceBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2019·Granted Jan 5, 2021·2 cites·19 claims
- 0470US2024127408A1Adaptive deformable kernel prediction network for image de-noisingINTEL CORP·Filed 2023·Application pending·0 cites
- 0562US2025279836A1Display device, display device connection system, and method for display device connectionOPTOMA CORP·Filed 2024·Application pending·0 cites
- 0655US12206403B2Switch circuit structure having reduced crossovers and layout system thereofRICHWAVE TECHNOLOGY CORP·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 0754US2024186264A1Polymer layers for adhesive promotion and stress management in glass layers in integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 0854US2024213131A1Direct plating of copper on dielectrics for glass core platingINTEL CORP·Filed 2022·Application pending·0 cites
- 0954US2024111089A1Nanorod coating between two optical mediumsINTEL CORP·Filed 2022·Application pending·0 cites
- 1052US12512397B2Substrates having adhesion promotor layers and related methodsTHE INTEL CORP·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1152US2024006283A1Edge delamination and crack prevention methods for sinx and ti-cu enabled packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1252US2024219632A1Technologies for integrated graded index lenses in photonic circuitsINTEL CORP·Filed 2022·Application pending·0 cites
- 1352US2024006297A1Silicide and silicon nitride layers between a dielectric and copperINTEL CORP·Filed 2022·Application pending·0 cites
- 1452US2023420389A1Stress-reducing dielectric-to-metal adhesion architecture for electronic packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1551US2023420322A1Organic adhesion promotor for dielectric adhesion to a copper traceINTEL CORP·Filed 2022·Application pending·0 cites
- 1651US2024113048A1Integrated horizontal varistor on glass core for voltage regulationINTEL CORP·Filed 2022·Application pending·0 cites
- 1751US2023395467A1Glass core architectures with dielectric buffer layer between glass core and metal vias and padsINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2023402368A1Technologies for thin film resistors in viasINTEL CORP·Filed 2022·Application pending·0 cites
- 1951US2023395445A1Glass core architectures with dielectric buffer layer between glass core and metal vias and padsINTEL CORP·Filed 2022·Application pending·0 cites
- 2050US2024006300A1Substrates having adhesion promotor layers and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 2150US2024006299A1Sinx based surface finish architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 2250US2023317583A1Modification of sinx thin film for improved adhesion of metal-dielectrics for hsio packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 2350US2023317584A1Plasma-induced surface functionalization of sinx thin film for improved adhesion of metal-dielectric for hsioINTEL CORP·Filed 2022·Application pending·0 cites
- 2450US2024006291A1Pocketed copper in first layer interconnect and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 2550US2024113046A1Embedded thin film varistor in through glass viasINTEL CORP·Filed 2022·Application pending·0 cites
- 2649US10332308B2Graphic rendering quality improvements through automated data type precision controlINTEL CORP·Filed 2014·Granted Jun 25, 2019·0 cites·19 claims
- 2749US2024006298A1Substrate having one or more electrical interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2848US2023085997A1Methods and apparatus to improve adhesion between metals and dielectrics in circuit devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 2947US2025259055A1Neural network with point grid convolutional layerINTEL CORP·Filed 2022·Application pending·0 cites
- 3047US2023420346A1Single lithography methods for interconnect architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 3146US2021297819A1Method for identifying existing groups, electronic device and group deviceCORETRONIC INTELLIGENT CLOUD SERVICE CORP·Filed 2021·Application pending·0 cites
- 3246US2023420353A1Asymmetrical dielectric-to-metal adhesion architecture for electronic packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3345US2025280185A1Circuit Board for Camera Module and Corresponding Camera ModuleNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Application pending·0 cites
- 3443US11615194B2Virtual storage services for client computing devicesINTEL CORP·Filed 2018·Granted Mar 28, 2023·0 cites·20 claims
- 3543US11240444B2Display panel, display device and image acquiring method thereofBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·17 claims
- 3643US2016321543A1Trusted predictive analytic execution middlewareINTEL CORP·Filed 2014·Application pending·0 cites
- 3743US2018174349A1Adaptive partition mechanism with arbitrary tile shape for tile based rendering gpu architectureINTEL CORP·Filed 2014·Application pending·0 cites
- 3831US10939264B2Cloud computing for mobile client devicesINTEL CORP·Filed 2015·Granted Mar 2, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →