Inventor · disambiguated record
Yonghao An
Also filed as: AN YONGHAO
4 granted patents·0 citations·filing 2017–2020
52Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0151US11804428B2Mixed pad size and pad designQUALCOMM INC·Filed 2020·Granted Oct 31, 2023·0 cites·22 claims
- 0250US11189575B1Specialized surface mount device for symmetric heat distribution in packageQUALCOMM INC·Filed 2020·Granted Nov 30, 2021·0 cites·18 claims
- 0345US11545411B2Package comprising wire bonds configured as a heat spreaderQUALCOMM INC·Filed 2020·Granted Jan 3, 2023·0 cites·30 claims
- 0437US11676873B2Semiconductor package having sealant bridgeINTEL CORP·Filed 2017·Granted Jun 13, 2023·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →