Inventor · disambiguated record
Youichi Andoh
Also filed as: ANDOH YOUICHI
3 granted patents·16 citations·filing 2004–2004
63Inventor score
Files withTDK CORP3
Top patents by PatentIndex Score
3 records- 0163US7164097B2Solder ball bonding method and bonding deviceTDK CORP·Filed 2004·Granted Jan 16, 2007·10 cites·4 claims
- 0256US7357295B2Solder ball supplying method and supplying deviceTDK CORP·Filed 2004·Granted Apr 15, 2008·6 cites·10 claims
- 0337US7267839B2Method of and apparatus for applying liquid materialTDK CORP·Filed 2004·Granted Sep 11, 2007·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →