Inventor · disambiguated record
Yong-Won Cha
Also filed as: CHA YONG W · CHA YONG WON
12 granted patents·4 pending applications·88 citations·filing 2000–2019
89Inventor score
Top patents by PatentIndex Score
16 records- 0186US7033908B2Methods of forming integrated circuit devices including insulation layersSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 25, 2006·49 cites·19 claims
- 0283US7332409B2Methods of forming trench isolation layers using high density plasma chemical vapor depositionSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 19, 2008·13 cites·13 claims
- 0370US8278186B2Wafer cleaning method and wafer bonding method using the sameCHA YONG WON·Filed 2007·Granted Oct 2, 2012·6 cites·17 claims
- 0467US7598177B2Methods of filling trenches using high-density plasma deposition (HDP)SAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 6, 2009·2 cites·22 claims
- 0566US7560383B2Method of forming a thin layer and method of manufacturing a non-volatile semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 14, 2009·2 cites·27 claims
- 0665US7781302B2Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regionsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 24, 2010·3 cites·17 claims
- 0765US7605022B2Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 20, 2009·4 cites·26 claims
- 0861US7470603B2Methods of fabricating semiconductor devices having laser-formed single crystalline active structuresSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 30, 2008·1 cites·27 claims
- 0953US7056827B2Methods of filling trenches using high-density plasma deposition (HDP)SAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 6, 2006·3 cites·26 claims
- 1048US6647957B1Fuel control valve for preventing sudden start of automobileFiled 2000·Granted Nov 18, 2003·5 cites·8 claims
- 1147US2009221133A1Methods of Fabricating Silicon on Insulator (SOI) WafersSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1245US2006102940A1Semiconductor device having a photodetector and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 1341US2014322834A1Apparatus and method for bonding substratesLTRIN CO LTD·Filed 2014·Application pending·0 cites
- 1436US2012072982A1Detecting potential fraudulent online user activityRANGANATHAN PREM·Filed 2010·Application pending·0 cites
- 1535US8999099B2Substrate bonding system and mobile chamber used theretoCHA YONG-WON·Filed 2010·Granted Apr 7, 2015·0 cites·5 claims
- 1625US12027486B2Substrate bonding apparatusL TRIN CO LTD·Filed 2019·Granted Jul 2, 2024·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →