Inventor · disambiguated record
You-Wei Chang
Also filed as: CHANG YOU-WEI
1 granted patent·3 pending applications·0 citations·filing 2022–2024
8Inventor score
Top patents by PatentIndex Score
4 records- 0157US12356742B2Chip packaging structure and chip packaging methodTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 0249US2025279336A1Microelectronic device package with multilayer package substrateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0346US2024006373A1Package substrate and method for fabricating chip assemblyTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
- 0446US2023360987A1Sensor package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →