Inventor · disambiguated record
Yoong Tatt Chin
Also filed as: CHIN YOONG T P · CHIN YOONG TATT · CHIN YOONG TATT P
6 granted patents·5 pending applications·13 citations·filing 2004–2023
76Inventor score
Top patents by PatentIndex Score
11 records- 0171US7291548B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2007·Granted Nov 6, 2007·5 cites·20 claims
- 0261US11264301B2System and method to enhance reliability in connection with arrangements including circuitsWESTERN DIGITAL TECH INC·Filed 2020·Granted Mar 1, 2022·0 cites·17 claims
- 0358US11094604B2System and method to enhance solder joint reliabilityWESTERN DIGITAL TECH INC·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 0454US2024194560A1Memory device and method of assembling sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0554US2024243101A1Stacked chip scale semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0651US10636722B2System and method to enhance solder joint reliabilityWESTERN DIGITAL TECH INC·Filed 2017·Granted Apr 28, 2020·0 cites·18 claims
- 0751US7244634B2Stress-relief layer and stress-compensation collar in contact arrays, and processes of making sameINTEL CORP·Filed 2004·Granted Jul 17, 2007·5 cites·21 claims
- 0848US2023137512A1Stacked ssd semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2021·Application pending·0 cites
- 0947US7253088B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2004·Granted Aug 7, 2007·3 cites·12 claims
- 1046US2023411340A1Semiconductor device including embedded memory dies and method of making sameWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 1135US2005224951A1Jet-dispensed stress relief layer in contact arrays, and processes of making sameSUH DAEWOONG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →