Inventor · disambiguated record
Youngsang Cho
Also filed as: CHO YOUNGSANG
14 granted patents·6 pending applications·43 citations·filing 2009–2025
88Inventor score
Top patents by PatentIndex Score
20 records- 0192US9654528B1Dynamic bitrate selection for streaming mediaGOOGLE INC·Filed 2013·Granted May 16, 2017·24 cites·21 claims
- 0287US10205984B1Dynamic bitrate selection for streaming mediaGOOGLE INC·Filed 2017·Granted Feb 12, 2019·5 cites·20 claims
- 0382US11854648B2Method of resetting storage device, storage device performing the same and data center including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·1 cites·20 claims
- 0482US10937771B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·3 cites·17 claims
- 0581US10347611B2Semiconductor packages having redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·4 cites·19 claims
- 0678US11502061B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 15, 2022·2 cites·20 claims
- 0778US11488640B2Method of resetting storage device, storage device performing the same and data center including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 1, 2022·1 cites·19 claims
- 0878US2025357240A1Semiconductor package including a heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0972US12394687B2Semiconductor package including a heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 1071US12451400B2Semiconductor package having improved heat dissipation characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1171US11837581B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1259US11251102B2Semiconductor module including heat dissipation layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1359US10659832B1Dynamic bitrate selection for streaming mediaGOOGLE LLC·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 1459US8198722B2Semiconductor packageCHO YOUNGSANG·Filed 2009·Granted Jun 12, 2012·3 cites·20 claims
- 1559US2025316473A1Method of depositing thin layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1659US2025330289A1Electronic device comprising antenna and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1758US2024371718A1Semiconductor package including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1856US2025047341A1Electronic device including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1954US2023207417A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2049US11495578B2Semiconductor package and PoP type packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →