Inventor · disambiguated record
Yonghoe Cho
Also filed as: CHO YONGHOE
13 granted patents·3 pending applications·11 citations·filing 2018–2025
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD16
Top patents by PatentIndex Score
16 records- 0196US11862596B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 2, 2024·5 cites·20 claims
- 0294US11552037B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·3 cites·20 claims
- 0386US10748953B2Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 18, 2020·2 cites·20 claims
- 0478US11335719B2Semiconductor package including an image sensor chip and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·1 cites·20 claims
- 0571US11824076B2Semiconductor package including an image sensor chip and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·19 claims
- 0669US12431474B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 0766US11869818B2Chip-stacked semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·12 claims
- 0862US11328966B2Chip-stacked semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 0956US10615213B2Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 7, 2020·0 cites·23 claims
- 1052US12439715B2Image sensor package and system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·18 claims
- 1152US2024170455A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1252US2023411355A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1350US11776941B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1447US2025372537A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1546US10636760B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·19 claims
- 1645US11244894B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 8, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →